Described in this document are application ideas and reference designs for the TLC5940 LED driver. The following application example shows the building of a basic module of an LED display system using a cascading connection on n TLC5940 devices connected to a controller. The reference design implements three TLC5940 devices to drive 16 LEDs.

Decoupling the power supply pins of high-speed operational amplifier circuits is critical to their operation. Decoupling is also one of the least understood topics in engineering. It is seldom given the time or care required yet it is relatively simple. This document will explain the pitfalls in decoupling and offer some correct techniques.

Moisture Sensitive Classification of Flange Mounted Packages at Texas Instruments

The last year has seen the introduction of silicon temperature sensors in revolutionary small packagesideal for portable systems. This application report discusses trade-offs in accuracy as well as how tochoose between thermistors and analog output IC temperature sensors.

This application report discusses using the Texas Instruments LM25066 in an Intel™ Node Manager 2.0 System.

Caller ID is a method of transmitting the telephone number and/or name of the caller to the subscriber via a burst of V23 or BEL202 data during the ringing phase of a telephone call. Various methods of signaling the start of this message are used in different countries and this report attempts to identify a near universal core routine for handling the messages within the DSP environment. ADSI is a

Using External Soft Start Circuit for UCC2806x

The steady increase in memory densities used in microprocessor based systems has stretched functional test times. The boundary scan standard IEEE 1149.1 offers a solution to the problem of testing static memory by supplying the access needed to control built-in-self-test (BIST) functions. This document describes generation patterns using parallel signature analysis (PSA) and BIST generated wavef

In an increasingly wireless world electrostatic discharge and electromagnetic interference are both potential issues for portable battery packs. This application report discusses the causes of ESD and EMI issues in battery pack designs and offers solutions for mitigation.

DRV2603, DRV2604, DRV2605 Benefits of LRA Auto-Resonance Tracking

The packing and shipping of bare-die product is relatively new especially in the tape-and-reel packing format. Bare-die format assumes that the devices will be handled in a clean-room-type environment and that the packing materials used to ship the dies will be as clean as possible. Texas Instruments has developed a plan for testing multiple carrier-tape materials from multiple suppliers. The obj

A typical example for a solution to drive six strings of twelve LEDs in series running at 20mA per string is described in details in this application report.

TP3070 COMBO II Performance with V.90 56K Modems

Controlling TAS5026 Volume After Error Recovery

This document describes issues of interest related to migration from the Texas Instruments TMS320C6211B/C6711/C6711B GFN package and TMS320C6711C GDP package to the TMS320C6711D digital signal processor (DSP) GDP package. The objective of this document is to indicate differences between these devices. Functions that are identical between these devices are not included. For detailed information on

This application report explains in detail each of the protections provided by SPiKe protected audioamplifiers the advantages they bring to audio designers and why they are necessary.

A double-precision complex Fast Fourier Transform (FFT) C-callable code library has been developed for the Texas Instruments (TI)(tm) TMS320C54x fixed-point digital signal processor (DSP). The library includes routines and the necessary 32-bit coefficients to process both the FFT and the inverse FFT (IFFT) for 32-bit complex-valued input data. The routines can accommodate input data lengths of 8

This application report demonstrates how a programmer can be implemented by using the EKTM4C123GXL LaunchPad to communicate with the serial bootloader (SBL) over UART, I2C or SSI serial peripherals of