This application note explores the technique of zero voltage switching in modern power conversion. It describes several ZVS topologies and applications limitations of the ZVS technique and a generalized design procedure. Two design examples are presented: a 50W DC/DC converter and an off-line 300W multiple output power supply. This discussion concludes with a performance comparison of ZVS conve

AN032 -- 2.4 GHz Regulations

Calibration of the bq6400 Battery Management Controller

This application note describes ADC sampling and configuring Stellaris microcontrollers through the StellarisWare Peripheral Driver Library or through direct writes to the device's control registers.

Interfacing external SDRAM to the Texas Instruments TMS320C6000™ digital signal processor (DSP) is simple compared to previous generations of TI DSPs because of the advanced external memory interface (EMIF). The EMIF is a glueless interface to a variety of external memory devices.

This application report describes the EMIF’s control registers and SDRAM signals along with SDRAM function

This application note describes how to use a single GC2011 chip to perform the real-to-complex down conversion operation on four signals simultaneously. The input data is split into even and odd samples and then multiplexed into a time division multiplexed (TDM) format. The even sample TDM stream is input to the A-input of the chip and the odd sample TDM stream is input to the B-input. The I-half

This application example demonstrates the basic use of Texas Instruments? <b>CC2420</b> ZigBee-ready RF transceiver together with the <b>MSP430F1611</b> MCU. The example shows how to <b>interconnect</

This application report has been superseded by the MSP430 Memory Programming User?s Guide (SLAU265). All information previously contained in this application report can be found in the user?s guide by

AN-146 FM Remote Speaker System

This application report describes methods to reduce the power consumption of the Hercules™-based microcontrollers and gives indications for the reduction that can be achieved.

All examples and values are based on the TMX570LS3137BZWT microcontroller and are measured on the TI internal silicon checkout board.

Measurement Notes

The measurements were done on non-production sil

Headphones typically have an impedance of 40Ω to 300Ω. By using the dual OPA2604 and four resistors one can economically drive a 2.8V peak signal into the 40Ω headphones.

This application report describes the library components and implementation of the RF code examples for the CC430F61xx and CC430F51xx sub-1GHz system-on-chip (SoC) devices. The examples include support for packet-handling modes including variable and fixed length filtering as well as the asynchronous and synchronous modes of communication. The document also explains the key RF configuration regi

This paper presents methods of achieving a good compromise in accuracy when carrying out extended-precision multiplications for the implementation of IIR (Infinite Impulse Response) filters.The 'C54x devices are 16-bit fixed-point processors and have several features that help to perform extended-precision computation efficiently.

Choosing an output capacitor for LDO regulators with PNP or PMOS pass element can be difficult to specific ESR requirements. This application note explains why higher ESR capacitors are necessary, how

The LM5032 dual current mode PWM controller contains all the features needed to control an interleavedboost converter. The two outputs operate 180° out of phase and have separate current limit inputs foreach channel. In addition to a high input voltage range the controller contains all the auxiliary featuresneeded to control a complete converter.

TVP7000EVM Quick Start Guide

This document contains implementation instructions for the two serializer/deserializer-based interfaces (SerDes) on the TMS320TCI6484 and TMS320C6457 DSP devices: <ul> <li>Serial RapidIO® (SRIO)

The Texas Instruments (TI) PowerFLEX family of voltage regulators offers surface-mount packages with high thermal-dissipation capability that can be mounted using standard techniques and equipment. This application report addresses power dissipation characteristics footprint sizes and land patterns; provides mechanical dimensions and tape-and-reel packing information; and illustrates solder-join