Increasing performance requirements of personal computers that necessitate a larger number of SDRAMs and DIMMs can be met by an FET-switch muliplexer. Four devices for memory interleaving for the 440BX and other core-logic chipsetsincorporate internal pulldown resistors damping resistors and make-before-break features that increase speed while maintaining minimal simultaneous-switching noise.

CC2530 FAQ

Today?s communications equipment requires DSPs to perform complicated algorithms in a limited amount of time. One such algorithm is the equalizer in a digital receiver. The equalizer removes distortions caused by the communications link between the transmit and receive antennae. This document discusses implementing an equalizer for the IS-54 standard on the fixed point TMS320C5x DSP. Background fo

Decompensated operational amplifiers have improved noise slew rate harmonic distortion etc. but required external compensation for stable operation. This report shows how to compensate such an amplifier and achieve the performance enchancement it provides in a unity-gain configuration.The THS4011 and THS4021 operational amplifiers are used to illustrate the superior performance mentioned a

Advances in digital signal processors (DSPs) are driving both high-computational performance and power efficiency into ever increasing application areas. The medical diagnostic ultrasound industry can

This article has been contributed to the TI Developer Wiki. To see the most recently updated version or tocontribute visit this topic at:

http://processors.wiki.ti.com/index.php/AM/DM37x_Power_Estimation_Spreadsheet

This article discusses the power consumption of the Texas Instruments AM/DM37x high

There are three General Purpose (GP) Timers in the Event Manager of the 'C240. These timers can be used as independant time bases in applications such as:? generation of sampling period in a control system? providing time base for quadrature encoder sensor signal processing in a motor control system? providing time base for the operation of Full and Simple Compare Units and associated

This document describes the Texas Instruments (TI?) TRF3520 evaluation module (EVM) board and associated EVM software, which allows the evaluation and the demonstration of the TRF3520 GSM RF Modulator

This application report provides the Electromagnetic Compatibility (EMC) performance comparison forradiated and conducted emissions between devices in the same high-frequency buck converter family.TPS54xx0-Q1 and TPS57xx0-Q1 devices have few differences in electrical parameters as listed inTable 2. These electrical parametric changes are achieved by implementing minor changes in metallayer

AN-984 Power and Thermal Considerations for High Speed Clock Generators

OA-23 CLC522 Advanced Operating Considerations and Military Specifications

This application report presents the design of an efficient V.34 transmitter and receiver pair. The algorithms behind the advanced encoding and decoding schemes of the V.34 recommendation are described and the assembly language functions that implement these algorithms are referenced. The entire assembly language source code of the project is provided with full documentation of the details of the

This document explains the maximum ESD diode current specified for GPIO on MSP microcontrollers. Sometimes signals on specific pins exceed the supply of the MSP MCU. In such a case, the device can han

The LM2650 evaluation board is provided as a tool for developing DC/DC converters based on theLM2650 IC. It is configured for single-output step-down DC/DC converters.

This guide provides tools for use when debugging a failing DDR3 interface on a KeyStone II device.

The reliability of a semiconductor is determined by the junction temperature, which in turn is dependent on several factors including device layout and mounting, package thermal resistance, PCB layout, heat sink interface, and ambient operating temperature. This application note describes PCB layout guidelines for the best thermal performance and reports on junction temperature measurements of the TRF1123 and the TRF1223. Finally, the failure rate of the TRF1123 and the TRF1223 are calculated using measured junction temperatures and known reliability data for the MESFET process.

The TRF1123 and TRF1223 are GaAs Monolithic Integrated Circuit MMICs packaged in a low-cost, 5 mm x 5 mm, 32-lead leadless plastic chip carrier (LPCC) package. The package has an 8 mil thick copper base (paddle) that extends through the bottom of the package. The package is designed to solder reflow the paddle to a ground pad on the PCB so that a low thermal resistance and excellent RF performance is achieved. The die is attached to the copper paddle using high thermal conductivity silver epoxy: Ablestik Ablebond 84-1 LMIS. The epoxy thickness is kept to a minimum. For the junction temperature test, the die are mounted in packages which have the tops removed so that the surface of the die is visible for infrared temperature measurement.

SB-111 Mass Storage - Hard Disk