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Application Notes

TMS320VC5421 Bootloader Technical Reference (Rev. A)

Texas Instruments
TMS320VC5421 Bootloader Technical Reference

Load Disconnect for the TPS6510x and TPS6514x

Texas Instruments
Many boost converters have an external rectifier diode. The input voltage of the TPS6510x and TPS6514x main boost converter is connected to the output voltage when the device is disabled. Due to the d

CC112x/CC120x RX Sniff mode with Smart Preamble

Texas Instruments
This application report shows an innovative way to use the DualSync functionality of the CC112x/CC120x to handle a new kind of preamble. By using what is called SmartPreamble the receiver is able to reliably detect exactly where it woke up in the preamble and use the eWOR timer to go back to sleep and then wake up right before the sync word.

DMA for eXpressDSP-Compliant Algorithm Producers and Consumers

Texas Instruments
This application note provides an overview of the DMA architecture specified by the TMS320 DSP Algorithm Standard (also known as XDAIS). It also describes two sets of APIs used for accessing DMA resources: the IDMA2 abstract interface and the ACPY2 library. In addition to providing an overview of fundamental DMA abstractions for eXpressDSP-compliant algorithms this application note highlight

U-104 Improved Charging Methods for Lead-Acid Batteries Using the UC3906

Texas Instruments
This application note describes the operation and application of the UC3906 sealed lead-acid battery-charger IC. Several charging circuits using this IC are described along with expected improvements in battery performance. This note also discusses uses for the many auxiliary functions of the part.

DN-70 UC3573 Buck Regulator PWM Control IC - Typical Application Circuit

Texas Instruments
This design note describes a typical application circuit for +12VDC input to +5VDC/1A output. A demonstration kit circuit schematic and list of materials are included.

LM3450_A Design Calculator Instructions

Texas Instruments
LM3450_50A Design Calculator Instructions

TMS320C6474 Multicore Digital Signal Processor Technical Brief

Texas Instruments
The TMS320C6474 DSP integrates three 1-GHz C64x+ DSP CPU cores, a host of high-speed peripherals, and large amounts of internal memory in a compact 23 mm by 23 mm package. These features allow the C64

Designing Modular EVMs for Data Acquisition Products

Texas Instruments
This document defines a common set of design guidelines or modular evaluation modules from the Data Acquisition Products group. Adherence to these recommendations ensures the highest degree of compatibility across system Development platforms. This document will help users of the 5-6K interface board (SLAU104) and the HPA449 Demonstration Board (www.softbaugh.com) develop a customizable reconfigu

Using the TMS320C24x DSP Controller for Optimal Digital Control

Texas Instruments
Although traditional microcontrollers include the necessary peripherals to provide solutions for digital control applications they lack both the performance and architecture needed to perform real-time math-intensive advanced control algorithms at a desired bandwidth.This application report describes the features of the Texas Instruments (TI)(tm) TMS320C24x digital signal processor (DSP) a

OMAP: Enabling Multimedia Applications in 3G Wireless Terminals

Texas Instruments
This paper describes how the Open Multimedia Applications Platform(tm) software and hardware architecture enables multimedia applications in third-generation (3G) wireless appliances. It provides an overview of OMAP(tm) strategy concepts main milestones and achievements. It also describes OMAP hardware architecture explains how multimedia applications can benefit from this advanced architectur

TPS65910x Power Sequencing Configurations

Texas Instruments
This document discusses the default voltages and boot orders of the TPS65910x power management integrated circuits (PMICs).

DRV10866 Lock Detection Functionality

Texas Instruments
DRV0866 DRV10866 Lock Detection Functionality

Land Pattern Recommendations (Rev. A)

Texas Instruments

The following land pattern recommendations are provided as guidelines for board layout and assembly purposes.

These recommendations cover the following National Semiconductor packages: PLCC, PQFP, SOP, SSOP and TSOP.

For SOT-23 (5-Lead) and TO-263 (3- or 5-Lead) packages, refer to land patterns shown in the Physical Dimensions for MA05A and TS3B or TS5B packages, respectively.

Powering the AM1705 and AM1707 With the TPS650061 (Rev. A)

Texas Instruments
This document details the design considerations of a power solution for the AM1705 and AM1707 (AM1705/07) low-power application processor with a TPS650061 three-rail Power Management Unit (PMU) or Power Management Integrated Circuit (PMIC).Portable application solution size demands a high level of integration and the AM1705/07 requires at least three different voltage rails with specific seq

TMS320C6416 Power-On Self Test (Rev. A)

Texas Instruments
The Power-On Self Test (POST) is designed to verify the operation of the TMS320C6416. Six modules are included in this test: Chk6xTest MemoryEdmaTest VcpTest TcpTest McbspTest and TimerTest. These modules check the proper operation of the CPU core internal memory and several on-chip peripherals (EDMA McBSPs timers Viterbi and turbo decoder coprocessors).

It is important to note that thi

Stabilizing difference amplifiers for headphone applications

Texas Instruments

The recent increase in popularity of high-fidelity headphones and lossless audio formats has caused many manufacturers of personal electronics to add high-quality audio outputs to their devices. As a result, 24-bit/192-kHz audio digital-to-analog converters (DACs), once reserved for home highfidelity systems, are now being incorporated into mobile devices such as cell phones, tablets, and portable music players. These DACs deliver extremely low-distortion signals, but are unable to drive headphones directly. To take full advantage of these high-performance parts, a well-designed headphone amplifier must also be added to the system.

Autonomous high density streaming protocol

Texas Instruments
This application report describes a new high density streaming protocol that was developed for the new series of ultra-low cost 2.4 GHz System-on-Chip (SoC) devices called CC2543/4/5. With this protocol it is possible to setup a large number of point-to-point links in the same physical environment. Examples of applications where such a protocol could be used are patient monitoring systems remote

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