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Application Notes

32-Kbit/S ADPCM With the TMS32010 ( Contains Scanned Text)

Texas Instruments
This report discusses 32-kbit/s Adaptive Differential Pulse Code Modulation (ADPCM) transcoders. A half-duplex ADPCM transcoder which complies with the CCITT recommendation (G.721) can be achieved with a single TMS32010. If the transcoder is used only for private lines a full duplex non-CCITT ADPCM transcoder is more cost-effective and can be designed with a single TMS32010 processor. Both the

TMS320TCI100 Power Sequencing Requirements (Rev. B)

Texas Instruments
This application report describes the power sequencing requirements for all TCI100 devices with respect to the dependencies associated with reset clock and signal pins during power up. It also explains what to avoid and potential issues associated with power-up sequencing with respect to the external memory interface (EMIF) peripheral.

Rotation Detection With the MSP430 Scan Interface (Rev. A)

Texas Instruments
This application report details the measurement principles for using an LC sensor to detect rotational movement. Based on this measurement principle an example project is presented demonstrating conta

DRV8301 Current Limiting Mode Layout Considerations

Texas Instruments
DRV8301 DRV8301 Current Limiting Mode Layout Considerations

AN-2145 Power Considerations for SDI Products (Rev. B)

Texas Instruments
This application report discusses the issues and trade-offs that VCC ripple has on the performance of SDI components.

BQ24750x Device Comparison

Texas Instruments
This application report presents the differences between bq24750 and bq24750A. It is intended to assist design engineers in selecting the most suitable device for their applications.

Hardware Design Guide for the TMS320C6472/TMS320TCI6486 (Rev. B)

Texas Instruments
This application report describes system design considerations for the TMS320C6472/TMS320TCI6486 (C6472/TCI6486) Digital Signal Processor (DSP). The objective of this document is to simplify the design of the C6472/TCI6486 device into a system/board design. In some cases there is information overlapping with the TMS320TCI6486 Communications Infrastructure data manual (

Minimizing Ringing at the Switch Node of a Boost Converter

Texas Instruments
The application report explains how to use proper board layout and/or a snubber to reduce high-frequency ringing at the switch node of a boost converter.

The ACF2101 Used as a Bipolar Switched Integrator

Texas Instruments
The ACF2101 is a dual switched integrator that is typically used to convert a positive input current to a negative output voltage by integration using an integration capacitor (CINT) either on the chip or an external capacitor provided by the user. Typical applications for the ACF2101 are photo diode integrators current measurements charge measurements and a CT scanner front end.

Overtemperature Protection in RS-485 Line Circuits

Texas Instruments
This application report describes the motivation for behavior of and reliability of overtemperature protection in RS-485 line circuits for TIA/EIA-485 physical layer line circuits. The behavior of the bus I/Os during an overtemperature event in the SN65LBC176A RS-485 line circuit is described.

Single-Supply Op Amp Design Techniques (Rev. A)

Texas Instruments
This application report describes single-supply op amp applications their portability and their design techniques. The single-supply op amp design is more complicated than a split- or dual-supply op amp but single-supply op amps are more popular because of their portability. New op amps such as the TLC247x TLC07x and TLC08x have excellent single-supply parameters. When used in the correct app

TI Optical Module 10G SFP+ Total Solution

Texas Instruments
TI Optical Module 10G SFP+ Total Solution

AN-1807 FPD-Link II Display SerDes Overview (Rev. B)

Texas Instruments
TI’s FPD-Link II family of embedded clock LVDS SerDes provide enhanced features and improved signal quality over prior generations of FPD-Link SerDes devices for Display applications. FPD-Link Chipsets serialized the wide parallel RGB buses down to 4 or 5 pairs of LVDS signaling depending upon the chipset. 18-bit RGB was serialized to three LVDS data lines and a LVDS clock while 24-bit RGB was s

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