High-efficiency, high-density power supplies have been a trend for communications equipment due to increasing power consumption and reduced board space. A stacked-FET switch enables high-efficiency and high-density solutions. Two real design examples are examined to illustrate this point. The first is a 30-A design where the benefits of a stacked-FET switch are evaluated relative to size reduction, efficiency gain and thermal budget savings. A second design implements the stacked-FET switch with an integrated driver to further increase system efficiency in a 60-A supply.

As modern electronics equipment advances in speed and performance, the number of power rails keeps increasing in addition to an increase in power consumption. Conversely, the physical area for power supplies keeps shrinking because precious real estate is given to the core ASIC and processors. As such, a high-efficiency, high-density power supply is a challenge for every power designer.

The new Tiva C Series ARM® Cortex™–M4 family of versatile microcontrollers provides prolific connectivity peripherals, such as the industry's first integrated Ethernet MAC and PHY, advanced analog integration and hardware floating-point performance. The TM4C123x and TM4C129x family of microcontrollers can be configured to operate in different power modes such as hibernation mode, deepsleep mode, sleep mode and run mode to optimize the balance between power consumption and performance to suit a wide range of end-applications. High-efficiency at both very low power consumption (deep-sleep mode and hibernation mode) and high performance (run mode at full system clock speed) has become indispensable for modern applications. Moreover, in handheld, battery-operated applications that simultaneously connect, communicate and control, high-efficiency power management is imperative to extend the battery stand-by time. This application report presents an ultra-low IQ (4.8 μA) power supply solution for Tiva C Series devices using the TPS62177, a high efficiency synchronous step-down DC-DC converter, based on the DCS-Control (Direct Control with Seamless Transition into Power Save Mode) topology. The TPS62177 interfaces seamlessly with Tiva C Series devices' low power modes, meeting the power requirements of embedded systems driven from 2- to 6-cell lithium batteries, as well as USB ports and higher voltage AC adaptors.

In comparison to a standard system n

The electromagnetic interference (EMI) rejection ratio, or EMIRR, describes the EMI immunity of operational amplifiers. An adverse effect that is common to many op amps is a change in the offset voltage as a result of RF signal rectification. An op amp that is more efficient at rejecting this change in offset as a result of EMI has a higher EMIRR and is quantified by a decibel value.

Texas Instruments has developed automotive grade DLP technology that enables highly-efficient, nextgeneration, full-color, true augmented reality (AR) automotive head-up display (HUD) systems. The uniqueness of DLP technology makes it possible to solve common design challenges of head-up display systems including managing environmental extremes and sunlight thermal loading, delivering high brightness and high resolution, and implementing dynamic dimming capabilities. Additionally, DLP projection-based architecture provides flexibility in the optical design needed to create very large field of view virtual displays over the road that augment and assist the driver. This paper includes a brief overview of DLP solid state illumination operation and how the implementation of DLP technology can solve the common HUD design challenges. DLP technology can be used to create advanced solutions for true automotive AR HUD applications.