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Application Notes

How to Select a Proper Inductor for Low Power Boost Converter

Texas Instruments
How to Select a Proper Inductor for Low Power Boost Converter PMP/Advanced_Low_Power/BCS/2_App_Reports/SLVA797

Processor SDK RTOS Customization: Modifying Board library to change UART instanc

Texas Instruments
Processor SDK RTOS Customization: Modifying Board library to change UART instance on AM335 /ASPH/AM3x_Subarctic/Application Reports/SPRAC32/SPRAC32

Battery-charging considerations for low-power applications

Texas Instruments

The wearable and personal-electronics industries are booming. Devices in this market vary wildly by application and use. These multifunction devices are designed to help people in their daily activities and make their lives comfortable. They can be found in different shapes, colors, sizes, and safety measures. They may differ significantly from each other, but they all have one thing in common—the need for a battery and a battery charger.

These portable devices are typically powered by batteries installed internal to the device, which must be charged efficiently and quickly on a regular basis. The user’s charging experience also needs to meet the requirement of safety, comfort, and convenience.

This article presents the trade-offs between linear chargers and switch-mode chargers. Specific challenges arise with each topology when used to charge a battery pack in wearable applications. The differences between linear and switch-mode topologies are described with details about how each topology can address the requirements of wearable and personal electronic devices. These details range from thermal performance to cost, including size, application area, features and flexibility, electromagnetic interference (EMI), bill-of-material (BOM) counts, charge time, and so on. Finally, there is an evaluation for which charger topology serves which type of requirement best. Understanding charger-related system-level details enables the designer to save both time and cost.

Datecodes and Shelf Life of Hermetic Packages

Texas Instruments

Texas Instruments hermetic packaged devices are fabricated in accordance with MIL-PRF-38535 and TI's own world class quality and reliability standards. The only age requirement for QML products is stated in MIL-PRF-38535 paragraph 3.10: Solderability. All parts shall be capable of passing the solderability test in accordance with TM 2003 of MIL-STD-883 on delivery. These products are warranted to do so in accordance with the Texas Instruments Incorporated Standard Terms and Conditions of Sale for Semiconductor Products.

Android Boot Optimization for IVI Systems

Texas Instruments

Boot-time optimizations are a critical component for a better Auto infotainment experience. This application report captures the details on how to improve android boot time and is meant to be a reference implementation. The end user (OEM/ODM/Customer/Product Owner) can review the optimizations that were tried and make a choice for the final product accordingly.

CC1310 Long Range Module (Rev. A)

Texas Instruments
CC1310 Long Range Module CC1310

Optimizing L Measurement Resolution for the LDC161x and LDC1101

Texas Instruments
Optimizing L Measurement Resolution for the LDC161x and LDC1101

Design Summary LMZ1xxx and LMZ2xxx Power Module Family (Rev. B)

Texas Instruments
Design Summary LMZ1xxx and LMZ2xxx Power Module Family ZHCA599 (Word file)

An Adaptable, Low Loss, Selective Filter and Gain Topology with Low Sensitivity (Rev. A)

Texas Instruments
An Adaptable, Low Loss, Selective Filter and Gain Topology with Low Sensitivity

TLC555-Q1 Used as a Positive and Negative Charge Pump

Texas Instruments

This application report describes an alternative use of the TLC555-Q1 device as a charge pump. The square-wave output switching between the supply voltage and GND with few additional capacitors and diodes makes the device suitable for generating a positive or negative voltage multiplier. Using the TLC555-Q1 device as a charge pump is a cheap and easy solution for doubling, tripling, or inverting the supply voltage.

A charge pump can be used in automotive applications requiring reverse battery protection. A diode can also be used for battery protection; however, it causes a voltage drop and lowers efficiency. The charge pump is also capable of driving a MOSFET transistor with low drain-to-source on resistance.

Charge pumps can be used in a nonsynchronous rectifier when in low dropout mode to cause a high output ripple with light load. The charge-pump output can be connected to the BOOT pin for providing the necessary voltage to drive the upper-pass transistor.

DLP? Series-244 DMD and System Mounting Concepts Mech and Therm App Report

Texas Instruments
DLP? Series-244 DMD and System Mounting Concepts Mech and Therm App Report

Optimizing L Measurement Resolution for the LDC1312 and LDC1314

Texas Instruments
Optimizing L Measurement Resolution for the LDC1312 and LDC1314

WiLink 8.0TM WLAN IP Mesh Application Report

Texas Instruments
This application report contains information on the WiLink 8 software mesh solution.

High Speed Serial Bus Using the MibSPIP Module on Hercules-Based MCUs

Texas Instruments
This application report describes how the Multi-Buffered Serial Peripheral Interface Module (MibSPIP) and the DMA modules found on many devices of the Hercules MCU family can be used to autonomously transfer data from and into the device embedded RAM. In addition to this the parallel pin option of the MibSPIP module will be covered and used to increase the speed of the SPI link. This technique co

Validating High Speed and Full Speed USB on the TMS320C5545 Device

Texas Instruments
This application report describes the process to validate electrical requirements of high and full speed USB operations on the TMS320C5545 device.

TPS65982 FW Update from Embedded Controller Over I2C

Texas Instruments
TPS65982 FW Update from Embedded Controller Over I2C TPS65982, TPS65981, TPS65986

Flashing Binaries to DRA7xx Factory Boards Using DFU

Texas Instruments
This application report provides detailed procedures for flashing the binary images to eMMC Flash memory using Device Firmware Upgrade (DFU). Generally the MMC/SD boot mode can be used to boot the fresh production board/EVM. In case there is not an external MMC/SD card available as part of production EVM or final product this application report will be useful to flash the images to the factory b

BPSK Modem Implementation With MSP432 MCUs

Texas Instruments
This application report introduces how to implement a 125-kbps BPSK modem by taking advantage of the CMSIS DSP Library with on-chip timer and 1-Msps ADC on the MSP432P401R. The MSP-EXP432P401R LaunchP

Common Design Challenges and Proper Use of Fully Differential Amplifiers (FDA)

Texas Instruments
Common Design Challenges and Proper Use of Fully Differential Amplifiers (FDA)

Displaying 5881 - 5900 of 6622

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