This application report explains how use TI’s reliability de-rating tools to calculate a component level FIT under power on conditions for a system mission profile.

This design note provides plots from sensitivity versus frequency offset measurements for different data rates on the CC2500 device. The results are also applicable for CC2510/CC2511. The required crystal accuracy is calculated from these plots.

Application Note 744 Futurebus+ Wired-OR Glitch Effects and Filter

Compliance to EMI limits is often a challenge. Spread spectrum clocking is commonly used to minimize EMI. The effect of modulating periodic signals both clock and data reduces the peak emissions by spreading the energy over a range of frequencies. The DS90UR241 and DS90UR124 chipset allows the use of spread spectrum clock and data inputs. The following is a discussion of spread spectrum clock ch

SN65LVDS324 SN65LVDS324 Implementation Guide

This report describes how to configure the TLV320AIC3254 (or AIC3254) very low-power stereo audio codec for stereo automatic gain control (AGC) operation.

The automotive industry is faced with increasingly strict environmental regulations which require that automotive module designs include real-time monitoring and off-line fault isolation. These requir

The purpose of this design note is to show the necessary steps to successfully scan through a frequency band covering n numbers of channels, and find the strongest signal in the band.

This application note provides information about the 20-watt simple switcher forward converter.

This application note discusses the use of the LMH6555 as a high-speed ADC input driver.

AN-1297 Comparison of COP8SAx7 to the Flash Based COP8TAx9 Family - Har dware and Software Considerations

The TRF3761 devices are typically sampled separately from the board provided. This guideline is designed to help the user evaluating these parts install the sample device.

This article has been contributed to the TI Developer Wiki. To see the most recently updated version or to contribute visit this topic at:

http://processors.wiki.ti.com/index.php/AM37x_CUS_Routing_Guidelines.

CUS package is designed with a new technology called Via Channel™ array. This technology allows for e

A new IC zener with low dynamic impedance and wide operating current range significantly simplifies reference or regulator circuit design. The low dynamic impedance provides better regulatio

Advanced bus-interface logic (ABIL) products processed in submicron advanced BiCMOS technologies (ABT) address the specific end-equipment demands of workstations personal and portable computers and telecommunications markets. This document discusses ABIL as system bus interfaces the merits of ABT its I/O structure packaging and ABT products for end-equipment specific solutions.

TAS5766M PurePath? Smart Amp Overview

Using the bq24075 Charger and bq27500/1 Fuel Gauge Together

PowerPAD™ Made Easy Application Brief

Incorporating fine-pitch packages into designs reduces the required board-space that is at a premium in designs with higher levels of integration. This document discusses the five types of fine-pitch packaging for TI?s FIFO line their manufacture the palladium-plated lead frames their testability and their design considerations.