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Application Notes

MSL Ratings and Reflow Profiles

Texas Instruments
This application reports explains the relationship of MSL rating to floor life and surface mount reflow temperatures for TI semiconductors.

Get More Power Out of Dual or Quad Op-Amps

Texas Instruments
Get More Power Out of Dual or Quad Op-Amps

High-Speed, Analog-to-Digital Converter Basics

Texas Instruments
The goal of this document is to introduce a wide range of theories and topics that are relevant to high-speed, analog-to-digital converters (ADC). This document provides details on sampling theory,

Sensor Optics Selection Guide for 3D ToF Camera Systems

Texas Instruments

In a camera, the lens ensures that light coming from a given point in a scene reaches a given pixel. When an ideal lens is in perfect focus, light coming from a given point in the image will reach a given pixel only. This is an important optical component which enables cameras, including 3D time-of-flight (ToF) cameras, to work. 3D ToF cameras have certain distinct characteristics which have special requirements to be met with while selecting or designing the lenses. This document explains how to decide the specifications for 3D ToF cameras. It also describes how to choose or design lens holders.

Mounting Hardware and Quick Reference Guide for DLP Advanced Light Control DMDs

Texas Instruments

This Application Note is a reference guide for the Mounting Hardware of DLP Advanced Light Control (ALC) digital micromirror devices (DMD).

This guide briefly describes the DMD mounting hardware, including figures and tables for each DLP DMD. The figures show mounting concepts with their associated DMD mounting hardware parts. The tables list the individual mounting hardware parts, weblinks to the supplier’s ordering page (if applicable), and weblink to the dedicated “System Mounting Concepts” Application Report. This Quick Reference Guide comprehensively addresses the DMD Specifications and System Mounting Concepts and includes important application design considerations.

Calculating and Optimizing Efficiency in LCD Backlight Drivers

Texas Instruments
Backlight displays have become the largest power consumer in mobile devices and personal electronics.When selecting components for an LED driver efficiency is the most important consideration. The fivemain backlight driver components that generate the most power loss include: the boost inductor switchingFET Schottky diode quiescent current and headroom voltage. This application note wil

Schottky Diode Selection in Asynchronous Boost Converters

Texas Instruments
Asynchronous boost converters require a Schottky diode as the rectifying element due to the diode's lowforward voltage and fast turn-on time. Because of these characteristics asynchronous boost converterscan have as good as or better efficiency than synchronous boost converters. This is especially true whenthe boost conversion ratios (VOUT/VIN) are high and the Schottky diode conduction t

Wireless Motion Detector With Sub-1 GHz SimpleLink Wireless MCU

Texas Instruments

This application note discusses the main challenges related to wireless motion detector design and how they are addressed by the SimpleLink Sub-1 GHz CC1310 and SimpleLink Dual-band CC1350 wireless MCUs. First, the application note gives a short overview of a wireless motion detector. Then the application report discusses the wireless technology requirements which must be met to support motion detector use cases and explains why Sub-1 GHz technology is an excellent fit.

This application note explains how to build the system based on the SimpleLink CC1310 Sub-1 GHz wireless MCU or the SimpleLink CC1350 dual-band wireless MCU, with focus on low power, networking, and cloud connectivity, as well as Sub-1 GHz and Bluetooth low energy use cases. The document concludes by describing a potential use case, including its state machine and power consumption analysis.

Thermocouple Temperature Measurements Using Isolated Amplifiers (Rev. A)

Texas Instruments

The most common thermocouple in use today is the Type K. A Type-K thermocouple is inexpensive, accurate, and works reliably in harsh environments. Type-K thermocouples can measure temperatures ranging from –200°C to +1250°C and have a Seebeck coefficient of S = 41 μV/K at room temperature.

High Speed Layout Guidelines (Rev. A)

Texas Instruments
Thisapplicationreportaddresseshigh-speedsignalssuchas clocksignalsand theirroutingand givesdesignersa reviewof the importantcoherences.Withsomesimpleruleselectromagneticinterferenceproblemscan be minimizedwithoutusingcomplicatedformulasand expensivesimulationtools.Section1givesa shortintroductionto theorywhileSection

Comparing Bus Solutions (Rev. C)

Texas Instruments
The stronginterestin this applicationreportpromptedthis thirdedition.In additionto the changesandupdatesmadethroughoutthesesectionsthis editionalsodiscussesLocalInterconnectNetwork(LIN)USB-On-the-GoDisplayPortdigitalisolatorsand more.This applicationreportservesas a referencetoolfor findingthe mostappropriatedatabus solut

Temperature Sensors: PCB Guidelines for Surface Mount Devices

Texas Instruments

Power hungry electronic components such as CPUs, GPUs, or FPGAs, as well as voltage regulators heat up during operation. Some applications require ambient air temperature measurements while others need to measure the temperature of a nearby component on the PCB. Measuring ambient air temperature with a surface mount technology (SMT) device is challenging due to the thermal influence of other components within the system. In other systems, in which the temperature of a component needs to be measured, ambient air temperature can influence and degrade the measurement accuracy. The system designer needs to make certain design decisions regarding both package type and PCB layout when integrating a temperature sensor.

This application note provides recommendations to system designers and explains methods for improving the accuracy of the temperature point being measured. The Recommendations are provided both for air temperature measurements and for component temperature measurement. The report details layout techniques, device orientation, and best practices for mounting.

Designing High Performance, Low-EMI, Automotive Power Supplies

Texas Instruments

From the adoption of driver-assistance cameras to the advancement of fuel efficiency, the intelligence of cars is constantly improving. With these new performance enhancements and their growing power demand, the automotive power management system is responsible for powering and protecting the downstream electronic components during nominal and transient conditions. This application report discusses the unique challenges to designing automotive power supplies.

PD Alternate Mode: Thunderbolt

Texas Instruments

The Thunderbolt Alternate Mode allows the two sides of a USB Type-C PD connection to discover, negotiate, and enter the Intel Thunderbolt 3 mode allowing transfer of high-speed data. The mode is negotiated using USB Power Delivery messaging, as listed in the USB PD specification. This application report explains the standard implementation of the Thunderbolt Alternate Mode and how it can be used with the Texas Instruments TPS6598x family of USB Type-C and USB PD controllers and associated software tools.

mmWave Radar Sensors: Object Versus Range

Texas Instruments

This application note includes an object versus range table to list the detection range capabilities of TI’s mmWave radar sensors. The method used for data collection is reported and the data for the maximum range recording for each objects is provided. Intuitions that can be gained from the table regarding radar cross section and maximum range detection are included.

How to Improve Speed and Reliability of Isolated Digital Inputs in Motor Drives

Texas Instruments

Digital Input receivers are used in AC and servo motor control to interface various 24-V signals to the control module of the drive. These signals include inputs from field sensors and switches, position and speed feedback encoded as 24-V signals, clock or PWM inputs for speed control, and emergency stop signals, such as Safe Torque Off (STO). Isolation is used to manage ground potential differences.

Over Current Latch with Low Side Sense

Dialog Semiconductor

This design uses a single Dialog GreenPAK SLG46110 to realize a low-side sensing over current detection circuit with a latching output used to enable/disable an external high-side PMOS load switch. By configuring one of the onboard comparators (ACMP1) to perform as a Non-Inverting Amplifier with a gain of 22.5, we can use a very small 0.010 ohm low-side sense resistor to, in this case, detect a 4A maximum current.

EMI Mitigation Techniques Using the LMZM23601

Texas Instruments
Electromagnetic Interference (EMI) is an unwanted coupling of signals from one circuit or system toanother. EMI is separated into two different categories: conducted and radiated. Conducted EMI is aform of conduction coupling caused by parasitic impedance power and ground connections. RadiatedEMI is the coupling of unwanted signals from radio transmission. This application note covers the E

Displaying 1861 - 1880 of 6622

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