R-78S3.3-0.1-EVM-1/STM-1
RECOM Power Inc.Power Management IC Development Tools Accessory for Eval B R-78S3.3-0.1-EVM-1
SimpleLink™ Multi-Band CC1352P Wireless MCU LaunchPad™ Development Kit
Texas InstrumentsThe CC1352P device is a true multi band wireless MCU supporting long range applications with the industry’s lowest power integrated +20 dBm power amplifier (PA). The CC1352P enables concurrent operation at both 2.4 GHz and Sub-1 GHz frequencies with PA support determined by external RF matching components.
To kick start your development, we offer two LAUNCHXL-CC1352P LaunchPads with optimized external RF components, one for Sub-1GHz PA and another for 2.4GHz PA wireless operations:
LAUNCHXL-CC1352P1:
Sub-1 GHz operation at 868 MHz / 915 MHz up to 20 dBm
2.4 GHz operation up to 5 dBm
LAUNCHXL-CC1352P-2:
Sub-1 GHz operation at 868 MHz / 915 MHz up to +14 dBm
2.4 GHz operation up to +18 dBm (For Europe, 2.4 GHz operation is certified up to +10 dBm)
The CC1352P device is part of the SimpleLink™ microcontroller (MCU) platform which consists of Wi-Fi®, Bluetooth® low energy, Sub-1 GHz and host MCUs, which all share a common, easy-to-use development environment with a single core software development kit (SDK) and rich tool set.
Features:
LaunchPad with multiband radio supporting concurrent 2.4 GHz and sub-1 GHz operation
Broad band antenna support for Sub-1 GHz (868 MHz / 915 MHz) and 2.4 GHz frequency bands
On-board emulator gets you started with instant code development
All IOs accessible on pin headers compatible with the LaunchPad/BoosterPack eco system
What's included:
LaunchPad Board
Micro USB Cable
Quick Start Guide
TPS65987 Single Port USB Type-C and PD Controller Evaluation Module
Texas InstrumentsThe TPS65987-90EVM is a complete reference design for USB Type-C and Power Delivery Applications featuring a variable DC/DC architecture to optimize board layout and minimize BOM cost. In addition, when paired with the DP-EXPANSION-EVM the user can emulate a full-featured USB Type-C PD host or device.
Features:
USB Power Delivery testing and verification
USB Type-C testing and verification
TPS65987D has two internal power paths (w/ protection)
DisplayPort Alternate Mode and USB Data verification (when used with DP-EXPANSION-EVM)
FTDI chip on board to flash a custom project through micro-B connector
TPS65988 Dual Port USB Type-C PD Evaluation Module
Texas InstrumentsTPS65988 Dual Port USB Type-C PD Evaluation Module
INA233 Current Shunt Monitor Evaluation Module
Texas InstrumentsINA233 Current Shunt Monitor Evaluation Module
AXC-SMALLPKG1EVM for Small Package Direction-Controlled Translation Devices
Texas InstrumentsThis EVM is designed to support SN74AXC8T245 in the RJW package and SN74AXC1T45 in DEA and the DTQ packages. There is also option of populating the SN74AVC4T245 in the RSV package. It is also designed to support the bus hold and Q1 devices for the respective channel counts.
The AXC devices belong to the low voltage direction controlled translation family with operating voltage from 0.65V to 3.6V with 12mA of drive strength. The AVC are low voltage translation devices operating from 1.2V -3.6V with lower drive strength of 12mA.
Features:
High speed SMB connector available
Ground port for each header pin supports high speed measurement
DIR and OE pin have the option of 10K ohm resistor pullup or pulldown
Layout optimized for high speed connectivity
Highlights the Small Package technology of TI
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