Description

The AD7705 / AD7706 are complete analog front ends for low frequency measurement applications. These 2-/3-channel devices can accept low level input signals directly from a transducer and produce serial digital output. The devices employ a Σ-Δ conversion technique to realize up to 16 bits of no missing codes performance. The selected input signal is applied to a proprietary, programmable-gain front end based around an analog modulator. The modulator output is processed by an on-chip digital filter. The first notch of this digital filter can be programmed via an on-chip control register, allowing adjustment of the filter cutoff and output update rate. The AD7705 / AD7706 devices operate from a single 2.7 V to 3.3 V or 4.75 V to 5.25 V supply. The AD7705 features two fully differential analog input channels; the AD7706 features three pseudo differential input channels. Both devices feature a differential reference input. Input signal ranges of 0 mV to 20 mV through 0 V to 2.5 V can be incorporated on both devices when operating with a VDD of 5 V and a reference of 2.5 V. They can also handle bipolar input signal ranges of ±20 mV through ±2.5 V, which are referenced to the AIN(−) inputs on the AD7705 and to the COMMON input on the AD7706.The AD7705 / AD7706 devices, with a 3 V supply and a 1.225 V reference, can handle unipolar input signal ranges of 0 mV to 10 mV through 0 V to 1.225 V. The devices can accept bipolar input ranges of ±10 mV through ±1.225 V. Therefore, the AD7705 / AD7706 devices perform all signal conditioning and conversion for a 2-channel or 3-channel system. The AD7705 / AD7706 are ideal for use in smart, microcontroller, or DSP-based systems. The devices feature a serial interface that can be configured for 3-wire operation. Gain settings, signal polarity, and update rate selection can be configured in software using the input serial port. The parts contains self-calibration and system calibration options to eliminate gain and offset errors on the part itself or in the system. CMOS construction ensures very low power dissipation, and the power-down mode reduces the standby power consumption to 20 μW typ. These parts are available in a 16-lead, wide body (0.3 inch), plastic dual in-line package (DIP); a 16-lead, wide body (0.3 inch), standard small outline (SOIC) package; and a low profile, 16-lead, thin shrink small outline package (TSSOP).