Part Number: TCF200-01180118-020-1PC
Description
TCF Ultra-Thin Carbon Fiber Thermal Pads
Features:
- Soft surface
- Good compressibility
- Low thermal impedance
- Good thermal stability
- Ultra-thin design
- Highly flexible, can replace thermal grease material
Applications:
- Graphic Processors
- Base Stations
- Microprocessors
- Telecommunications
Specifications:
| LEADER TECH SERIES | TCF160 | TCF200 | TCF250 | TCF350 |
|---|---|---|---|---|
| Thermal Conductivity Z (W/m-K) | 16 | 20 | 25 | 35 |
| Thermal Conductivity X,Y (W/m-K) | 10 | 10 | 10 | 10 |
| Thermal Resistance (°C-in^2/W; @20Psi) | ≤ 0.2 | ≤ 0.18 | ≤ 0.15 | ≤ 0.05 |
| Color | Gray Black | Gray Black | Gray Black | Gray Black |
| Thickness (in) | 0.010 - 0.118 | 0.020 - 0.118 | 0.020 - 0.118 | 0.010 - 0.031 |
| Density (lb/in^3) | 0.123 | 0.119 | 0.108 | 0.067 |
| Hardness (Shore 00) | 65 | 65 | 65 | 65 |
| Compression Ratio @50 Psi (%) | ≥ 40 | ≥ 40 | ≥ 40 | ≥ 30 |
| Operating Temperature (°F) | -58 to 356 | -58 to 356 | -58 to 356 | -58 to 356 |
