Description

The TI 54-ball low-profile fine-pitch ball grid array (TFBGA) meets dimensions specified in JEDEC MO-205 Variation DD. This 0.8-mm-pitch BGA allows economical OEM designs where smaller-pitch 16-bit BGA is either not necessary or is cost prohibitive from a printed circuit board (PCB) fabrication perspective. This BGA is qualified in both the lead (SnPb) and Pb-free (SnAgCu) ball versions at JEDE