56-Pin Quad Flatpack No-Lead Logic Package

Texas Instruments

Published Date: 02/07/2003

Description

Texas Instruments (TI) Quad Flatpack No-Lead (QFN) 56-terminal package complies with JEDEC standard MO-220 allows for board miniaturization and holds several advantages over traditional SOIC TQFP TSSOP and TVSOP packaging. This package designated RGQ by TI physically is smaller than traditional leaded solutions has a smaller routing area improved thermal performance and improved electric

Parts

Part Number Name Companion Part
74SSTV16859DGGRG4 74SSTV16859DGGRG4 Buy Datasheet
74SSTV16859RGQ8G3 74SSTV16859RGQ8G3 Buy Datasheet
74SSTVF16859G4RG4 74SSTVF16859G4RG4 Buy Datasheet
CSSTV32852GKFREP CSSTV32852GKFREP Buy Datasheet
SN74SSTV16857DGGR SN74SSTV16857DGGR Buy Datasheet
SN74SSTV16859DGG SN74SSTV16859DGG Buy Datasheet
SN74SSTV16859RGQ8 SN74SSTV16859RGQ8 Buy Datasheet
SN74SSTV16859RGQR SN74SSTV16859RGQR Buy Datasheet
SN74SSTV32852ZKFR SN74SSTV32852ZKFR Buy Datasheet
SN74SSTV32877GKER SN74SSTV32877GKER Buy Datasheet