This document describes the features and operation of the TMS320VC5410 Bootloader. The contents of the on-chip ROM also are discussed.Important Notice Regarding Bootloader Program Contents:Texas Instruments may periodically update the bootloader code supplied in the ROM to correct known problems provide additional features or improve functionality. These changes may be made without

LMG5200 Layout Guidelines for LMG5200 ~ 80-V, 10-A, GaN Power Stage Module

Capacitive touch detection is sometimes considered more art than science. This often results in multiple design iterations before the optimum performance is achieved. There are, however, good design p

AIC3266, AIC3262, AIC3263, AIC3216, AIC3212, AIC3213 AIC326x EMI Filtering on Speaker Outputs HPA/AIP/Audio_Converters/2-App_Reports/SLAA58

Numerical Protection Relays (NPRs) are critical elements in any power distribution network. Generally, there are several different types of NPRs. Each type, however, shares a similar architecture, thu

Describes the soldering requirements for the surface mount versions of all Plug-in Power products and gives guidelines for the development of a suitable reflow profile.

The Near Field Communication (NFC) market is emerging into multiple fields including medical, consumer, retail, industrial, automotive, and smart grid. Reader/Writer is one of the three operational mo

This document discusses the power consumption of the Texas Instruments TMS320C6411 digital signal processor (DSP). Power consumption on this device is highly applicationdependent so a spreadsheet is provided to model power consumption for a user?s application. To get good results from the spreadsheet realistic usage parameters must beentered. The low core voltage and other power design optim

Synchronous Rectification in High-Performance Power Converter Design

This application report describes how to interface the Texas Instruments (TI) TMS320C6000™ (C6000™) digital signal processor (DSP) to the Intel 80960Kx/Jx microprocessor. This document contains:

A block diagram of the interface

Information required to configure the Intel80960

Timing diagrams illustrating the interface functionality

Developing a CCStudio 2.0 DSP/BIOS Application for FLASH Booting on the TMS320C5402 DSK

Optimizing Power Controller Designs through Effective Utilization of Performance Feat ures (Adj Frequency & Sync, Ext Ref, Tracking, & Precision Enable)

AD-03 Effects of Aperture Time and Jitter in a Sampled Data

Many applications require that the analog-to-digital converter (ADC) be located near the field sensor; however the digital processing often occurs at a distance. Therefore the input and output signals need to travel through a long cable from the field sensor to the site where digital processing occurs. This application report is a guide for using a 1-meter cable the Samtec EQCD Series high data

This document describes the Texas Instruments (TI) TRF6900/MSP430 US evaluation kit (EVK) and associated software, which allows the evaluation and demonstration of the TRF6900, a 900-MHz ISM band tran

This document describes parasitic effects in integrated circuits (ICs) and the problems that result when protecting analog components using conventional methods. It presents examples of how these problems can be removed by using the TLC7726 hex clamping circuit

As more and more system components become embedded within the system processor chip new techniques are required for debug. Signals and busses that were historically available for probe connection at external package pins are now hidden from the users within the processor package. This problem is referred to as vanishing visibility meaning that the user can no longer employ traditional techniques

This document is a specification for the ELF-based Embedded Application Binary Interface (EABI) for the MSP430 family of processors from Texas Instruments. The EABI defines the low-level interface bet

This application report describes how the LMV112 clock buffer amplifier can resolve clock interferenceissue among different chipsets.