TMS320C6416 Power-On Self Test (Rev. A)
Texas InstrumentsThe Power-On Self Test (POST) is designed to verify the operation of the TMS320C6416. Six modules are included in this test: Chk6xTest MemoryEdmaTest VcpTest TcpTest McbspTest and TimerTest. These modules check the proper operation of the CPU core internal memory and several on-chip peripherals (EDMA McBSPs timers Viterbi and turbo decoder coprocessors).
It is important to note that thi
Stabilizing difference amplifiers for headphone applications
Texas InstrumentsThe recent increase in popularity of high-fidelity headphones and lossless audio formats has caused many manufacturers of personal electronics to add high-quality audio outputs to their devices. As a result, 24-bit/192-kHz audio digital-to-analog converters (DACs), once reserved for home highfidelity systems, are now being incorporated into mobile devices such as cell phones, tablets, and portable music players. These DACs deliver extremely low-distortion signals, but are unable to drive headphones directly. To take full advantage of these high-performance parts, a well-designed headphone amplifier must also be added to the system.
Autonomous high density streaming protocol
Texas InstrumentsThis application report describes a new high density streaming protocol that was developed for the new series of ultra-low cost 2.4 GHz System-on-Chip (SoC) devices called CC2543/4/5. With this protocol it is possible to setup a large number of point-to-point links in the same physical environment. Examples of applications where such a protocol could be used are patient monitoring systems remote
SN65LV1021/1212 SN65LV1023/1224 10:1 SERDES EVM
Texas InstrumentsSN65LV1021/1212 SN65LV1023/1224 10:1 SERDES EVM
Transition From Prior bqJunior Gauges to the bq27x10
Texas InstrumentsTransition From Prior bqJunior Gauges to the bq27x10
TPIC7218-Q1 Thermal Design Considerations and Solutions
Texas InstrumentsThis application report describes a methodology to predict the thermal response of the TPIC7218-Q1 in a realistic ABS environment. The methodology presented provides system and hardware engineers a c
Simplified Solutions for Hot Swap Power Management in Telecom Systems
Texas InstrumentsEngineers designing plug-in or adapter cards for the ?48-Vdc distribution environment often need an efficient, cost-effective means of implementing hot swap capability. Hot swap solutions vary in comp
Trapezoidal Control of BLDC Motors Using Hall Effect Sensors
Texas InstrumentsThis application report presents a solution for the control of brushless DC motors using theTMS320F2803x microcontrollers. TMS320F280x devices are part of the C2000™ family ofmicrocontrollers that enable the cost-effective design of intelligent controllers for three-phase motors byreducing the system components and increasing efficiency. Using these devices it is possible to realizefar mo
Client Side Telephony (CST) Chip Flex Mode Flex Examples Description
Texas InstrumentsClient Side Telephony (CST) Chip Flex Mode Flex Examples Description Application Report
Interface Circuits for TIA/EIA-232-F (Rev. A)
Texas InstrumentsThis design note provides information concerning the designing of TIA/EIA-232-F interface circuits. The TIA/EIA-232-F standard is covered including the electrical specification maximum cable lengths and the DB9S connector. The section entitled Optimizing PC Interface Devices discusses the following topics: SN75C185 power considerations interface power-consumption calculations the SN75LP185A an
MSP430F4270 Altimeter Demo
Texas InstrumentsThis application report describes the implementation of an altimeter using a fullyintegrated MCU solution with the MSP430F42x0 family of microcontrollers. An air pressure sensor is directly interfaced
CDAC Architecture Gives ADC574 Pinout /Sampling, Low Power, New Input Ranges
Texas InstrumentsThis application note compares basic current-mode successive approximation A/Ds with CDAC-based architectures, and shows how adding a resistor divider network to the CDAC input permits the Burr-Brown
Heat Sinking- TO-3 Thermal Model
Texas InstrumentsA critical issue with all semiconductor devices is junction temperature (TJ). TJ must be kept below its maximum rated value typically 150°C. The lower the junction temperature the better. The thermal circuit shown allows temperature to be estimated with simple calculations. The temperature rise across each interface is equal to the total power dissipated in the device ti
Implementing an Ultra-Low-Power, Single-Chip Thermocouple Circuit
Texas InstrumentsImplementing an Ultra-Low-Power, Single-Chip Thermocouple Circuit With the MSP430F423
Interfacing the DAC8564 to the MSP430F449
Texas InstrumentsThis application report describes how to interface the DAC8564 digital-to-analog converter (DAC) to the MSP430F449 mixed-signal microcontroller. This document discusses how the internal reference is d
Hot Plug-In In-Rush Current Limiting Circuits for PT3100/4100/3320 DC-DC Convert (Rev. A)
Texas InstrumentsIn-rush current is the initial current that flows to the converter’s input de-coupling capacitor(s) when the host board assembly is connected to an active input power source. The magnitude of the in-rush current is high and can induce arcing, transients, and erosion of the connector. Limiting the in-rush current allows the host board assembly to be safely plugged into a live system backplane connector, such as those powered from a -48V central office power supply.
OA-29 Low-Sensitivity, Highpass Filter Design with Parasitic Compensation (Rev. B)
Texas InstrumentsThis application report covers the design of a Sallen-Key highpass biquad. This design gives low component and op amp sensitivities. It also shows how to compensate for the op amp?s bandwidth (predis
