This application report presents various system designs possible using the FlatLink? transmitter: SN75LVDS83B, and the FlatLink? receivers: SN75LVDS82 and SN75LVDS86A. These are low-voltage differen

This application report describes how to communicate with the Hercules™ serial peripheral interface (SPI) bootloader. The SPI bootloader is a small piece of code that can be programmed at the beginning of Flash to act as an application loader as well as an update mechanism for applications running on a Hercules Cortex™-R4 based TMS570LS12x microcontroller.

There is an increasing demand to bring video and image processing capabilities to devices like video IP phones cellular phones and personal data assistants (PDAs). The images are brought to the user on liquid crystal displays that usually use thin film transistor (TFT) technology. These LCD devices require very specific timings and row/column formatting that can make them difficult to directly i

This design note describes a demo board for the UC3853 8-pin High Power-Factor Preregulator Integrated Circuit. This demo board was designed for 100W 75kHz operation over a universal input-voltage range (80VAC to 270VAC). A parts list and schematic diagram for the typical application circuit are included in this design note.

This application report provides an overview of the host side design in the Multichannel Vocoder (MCV) Technology Demonstration Kit (TDK). Emphasis is given to overall system architecture and the major system components. The MCV TDK is currently running on TMS320C6201/C6701 EVMs. All algorithm components are compliant with the eXpressDSP Algorithm Standard and are run-time configurable.The MCV

UCD3138 ? Responding to Multiple PMBus Slave Addresses UCD3138

This application report discusses a way to increase the efficiency of the boost converter in a backlightdriver by reducing conduction and AC losses in the inductor thereby increasing the overall efficiency ofthe backlight driver at higher loads.

Improving Machinery Vibration Analysis

This application report describes the implementation of a single-phase electronic electricity meter using the Texas Instruments MSP430AFE25x metrology family of processors in two-chip architecture. The metering processor (MSP430AFE25x) assumes the role of a slave controlled by a host microcontroller (MCU) the MSP430F663x.

Thermal impedance (junction to ambient) is one of several indices reported to reflect the thermal performance of a package. This document shows the impact of the wind-tunnel k-factor test-board design parameters on thermal impedance results. It presents a software modelling approach using the THEATACAL software package. The design and results are provided with an analysis of the variance. Verifica

FilterPro™ MFB and Sallen-Key Low-Pass Filter Design Program User Guide

The availability of dual and quad packaged FET op amps offers the designer all the traditional capabilitiesof FET op amps including low bias current and speed and some additional advantages. The cost-peramplifieris lower because of reduced package costs. This means that more amplifiers are available toimplement a function at a given cost making design easier. At the same time the availab

This application report describes the parallelization and optimization of a hydraulic simulator kernel on a Texas Instruments (TI?) TMS320C40 multi-DSP (digital signal processor) platform. Research is

A DSP/BIOS PCM3002 codec Device Driver for the TMS320C6416 TEB Application Report

This document describes the changes being made to the previously released bq20z70 (v101) design.

This designer note page describes how to properly interpret the Texas Instruments (TI?) TMS320C5x timing specifications to design an interface to memory and to other external devices. Designing a high-speed interface between the TMS320C5x digital signal processor (DSP) and memory or other parallel devices poses interesting circuit design considerations. The 'C5x device data sheet provides a wide v

Application Note 808 Long Transmission Lines and Data Signal Quality

LF READER SYNCHRONIZATION

A single chip pocket weigh scale is implemented using a resistive full-bridge sensor and a fully-integrated MCU solution using low-power design practices. The measurement results are obtained using