Four-Speed Fan Control Using Simple Remote Diode Temperature Sensor

FET Configurations for the bq76200 High-Side N-Channel FET Driver bq76200

DLP3000 DLP? Series-220 DMD and System Mounting Concepts DLP/Application_Reports/DLPA039_DLP3000

Application Note 293 Control Applications of CMOS DACs

The continuing development of high-performance processors is imposing stringent requirements on their respective power systems. Intel's Pentium(r)Pro power system specification for instance demonstrates the industry trend to operate at lower voltages and at higher currents with tight regulation and fast transient response. The UC3886 Average Current Mode PWM Controller meets these requirements.

DN610 -- Design Notes

U.S digital cellular terminal designs commonly use programmable digital signal processors (DSPs). All digital cellular transmitters employ conventional and CRC codes to protect against channel-induced errors. Receivers use Viterbi decoders and CRC syndrome checks to verify that the decoded data contains no errors. This document presents examples of error-protection and correction functions for VSE

Precise Tri-Wave Generation

Despite the fact that the UC3842 and the UCC3802 PWM Controllers are pin-for-pin compatible, they are not drop-in replacements for each other. Designed as the next generation '42, the UCC3809 also has

TVP5146 Anti-Aliasing Filters

This reference design is intended for designers who wish to design up to eight TMS320C6472 Digital Signal Processors into a system using a nominal input voltage of 5 V, with a flexible design using ex

This document describes considerations for migration from Texas Instruments TMS320DM6446 Digital Media System-on-Chip (DMSoC) to the TMS320DM6467 DMSoC. Both devices feature a dual-core architecture u

The TAS3001C stereo audio digital equalizer provides a serial control interface using the I2C protocol. Since the TAS3001C is more complex than the typical serial EEPROM often found on an I2C bus designers must consider additional aspects of the I2C specification. Methods of interfacing to the TAS3001C applicable to a wide variety of I2C masters are discussed.

The reliability of a semiconductor is determined by the junction temperature, which in turn is dependent on several factors including device layout and mounting, package thermal resistance, PCB layout, heat sink interface, and ambient operating temperature. This application note describes PCB layout guidelines for the best thermal performance and reports on junction temperature measurements of the TRF1123 and the TRF1223. Finally, the failure rate of the TRF1123 and the TRF1223 are calculated using measured junction temperatures and known reliability data for the MESFET process.

The TRF1123 and TRF1223 are GaAs Monolithic Integrated Circuit MMICs packaged in a low-cost, 5 mm x 5 mm, 32-lead leadless plastic chip carrier (LPCC) package. The package has an 8 mil thick copper base (paddle) that extends through the bottom of the package. The package is designed to solder reflow the paddle to a ground pad on the PCB so that a low thermal resistance and excellent RF performance is achieved. The die is attached to the copper paddle using high thermal conductivity silver epoxy: Ablestik Ablebond 84-1 LMIS. The epoxy thickness is kept to a minimum. For the junction temperature test, the die are mounted in packages which have the tops removed so that the surface of the die is visible for infrared temperature measurement.

SB-111 Mass Storage - Hard Disk

Output voltage swing output current and slew rate interact with many other specifications in operational amplifiers. This application note develops the definitions for each parameter and the relationship between important ac parameters such as large-signal bandwidth and distortion.

TPS2491 Using Hot-Swap Controllers for Reverse Powering FTT