This application report shows how to interface and operate the DAC8541 with a commercially available microprocessor or Texas Instruments DSP. Although this report uses a DSP as an example for the host interface the concept is generic in nature and therefore should fit any host processor selected to interface with this DAC. This report bridges the gap between digital signal system processing and a
The purpose of this document is to assist the designers of high-performance digital logic systems in using the advanced BiCMOS technology (ABT) logic family. Detailed electrical characteristics of these bus-interface devices are provided and tables and graphs have been included to compare specific parameters of the ABT family with those of other logic families. In addition typical data is provide
Building upon the software foundation architecture of DSP/BIOS DSP/BIOS II extends Texas Instruments? system software capabilities and services to enable the development of more advanced and complex applications; and provide support for traditional concurrent-system design paradigms. This support is a combination of additional software modules and modifications to the kernel to provide preemp
System designers can use receiver equalization to extend their RS-485 data transmission applications in terms of longer cable distances or higher signaling rates. This application report discusses the
This application report explains the benefits of using fixed voltage output versions of the TPS742xx, TPS743xx, and TPS744xx series of low-dropout (LDO) regulators from Texas Instruments. Fixed outpu
This report contains a comprehensive collection of the input and output characteristic curves of typical integrated circuits from various logic families. These curves go beyond the information given in data sheets by providing additional details regarding the characteristics of the components. This knowledge is particularly useful when for example a decision must be made as to which circuit shou
In an effort to standardize integrated-circuit (IC) package thermal-measurement methods JEDEC has released standards for test-board designs. Typical thermal metrics reported are package thermal resistance from junction to ambient (theta sub JA) and package thermal resistance from junction-to-case (theta sub JC). Recent data generated by Texas Instruments (TI) linear and logic package designers i
The UC1854 provides active power factor correction for power systems that otherwise would draw non-sinusoidal current from sinusoidal power lines. This device implements all the control functions necessary to build a power supply capable of optimally using available power-line current while minimizing line-current distortion. This application note describes the concepts and design of a boost prere
The TPS43000 is a high-frequency, voltage-mode, synchronous PWM controller that can be flexibly used in buck, boost, buck-boost, and SEPIC topologies. This reference design explains the design proced
The Tiva? C Series TM4C123x family of ARM? Cortex?-M4 microcontrollers features highly programmable, 5-V tolerant general-purpose input/outputs (GPIOs) with internal clamping and fail-safe electro sta
Charging discharging and the entire battery system can be complex and difficult to understand. Accurately measuring energy in and out of this battery system is just as complex. The bq2060/A was developed with extensive sophisticated functions and algorithms to measure energy transfer throughout a wide range of applications with accuracy. Thus configuring the bq2060 for the exact battery specif
This application report provides a solution with the LMV232 crest-factor-invariant RF power detector. TheLMV232 can accurately measure the average transmit power level in base stations so that quality ofservice and better system’s throughput in the corresponding cell can be achieved.