Dynamic Behavior of TLV320DAC23 and TLV320AIC23B

Capacitive proximity sensing is a key feature for many smart devices and equipment. In this application note, we review several important advantages of our new capacitive sensing chip FDC2x1y, which

Amplifiers and Bits: An Introduction to Selecting Amplifiers for Data Converters

This application report contains implementation instructions for the DDR2 interface contained on the TCI6482 DSP device. The approach to specifying interface timing for the DDR2 interface is quite different than on previous devices.

The previous approach specified device timing in terms of data sheet specifications and simulation models. The customer was required to obtain compatible memory de

Grid connected applications require an accurate estimate of the grid angle to feed power synchronous to the grid. This is achieved using a software phased-locked loop (PLL). This application report discusses the different challenges in the design of software phased-locked loops for three phase grid connected inverters and presents a methodology to design phased-locked loops using C2000 controllers

An interchangeable-thermistor temperature-measurement application is described and a basic framework circuit which can be modified to use alternative components is provided. When a potentiometer is used instead of a thermistor the application can also be used to measure other process variables. A basic understanding of active and passive analog devices is assumed.

Application Note 904 An Introduction to the Differential SCSI Interface

This application report describes a reference design implementing a battery-less RFID application that includes an E-Paper display, using the PaLFI eZ430-TMS37157 RFID board. The sample application co

TAS5508-5121K8EVM Application Report

Electrostatic Discharge (ESD) Protective Semiconductor Packing Materials and Configurations

As a new interface, InfiniBand (sm) presents a lot of expansion opportunities. However, in most new specifications, the true implementation details for the power requirements are either limited or lac

Simultaneous-switching noise can generate and propagate glitches in electronic systems. Therefore system designers are faced with challenges to minimize simultaneous-switching noise while increasing switching speed and improving signal quality. This report presents the performance of different TI logic devices under various simultaneous-switching conditions. Factors such as the number of bits sw

Analyzing Power Modules

TPS23753A Using the TPS23753A with an External Error Amplifier

This application note describes how to operate the LM27965 Evaluation Module.

This application report describes the interface between the Texas Instruments (TI) TMS320C6000™ digital signal processor (DSP) host port and the Intel 80960 microprocessor. The document includes schematics showing connections between the two devices PAL equations and verification that timing requirements are met for each device (tables and timing diagrams).

This document describes how to create a boot package and bootload one Texas Instruments (TI)(tm) TMS320C548 digital signal processor (DSP) with another TMS320C54x DSP.

This application report presents a method for interfacing the DAC8814 - a four-channel, current output, 16-bit multiplying digital-to-analog converter - to the MSP430F449 processor using the HPA449 fr

This document describes the logic to connect the SPARC Mbus to the TI Futurebus+ (FB+) chipset host interface (HIF). This logic is a translator of Mbus to HIF transactions and vice versa. Direct and paged-memory are described along with techniques for a 64-bit-only data path and a dynamically configurable 32-bit Mbus/32-bit HIF or 64-bit Mbus/64-Bit HIF.

TPS65920/30 Schematic Checklist