TPS65381-Q1 Design Checklist TPS65381-Q1

ADC Source Impedance Application Report

The Metrology Demo showcases the ability of the dual-core OMAP-L138 DSP+ARM processor to execute metrology functions, power analytics algorithms (FFT), and a Rogowski coil digital integrator on its TM

Vehicular Power Adapter Using ISRs PT78 PT79 ISR Series

A switching power supply consists of the power stage and the control circuit. The power stage performs the basic power conversion from the input voltage to the output voltage and includes switches and the output filter. This report addresses the boost power stage only and does not cover control circuits. The report includes detailed steady-stage and small-signal analysis of the boost power stage o

Hermetic Packages

This application report describes power-supply sequencing recommendations and techniques applicable to dual supply voltage DSPs in TI's TMS320C2000 TMS320C5000 and TMS320C6000 families. These techniques take advantage of the reset power good enable and soft-start features available on TI Power Management Products including low drop out regulators switching power supply controllers supply vol

The TMS320C6000? multichannel buffered serial port (McBSP) can operate in a variety of modes as per application requirements. For proper operation the serial port must be initialized in a specific order. This document describes the initialization steps necessary when either the (E)DMA or the CPU is used to service the McBSP data. Typically the (E)DMA is used to perform read/write transfers from

INA117 ±200V Difference Amplifier with Common-Mode Voltage Monitor

TVP5150AM1 VBI Quick Start

A number of instrumentation applications can benefit from the use of logarithmic or exponential signalprocessing techniques. The design and use of logarithmic/exponential circuits are often associated withinvolved temperature compensation requirements and difficult to stabilize feedback loops. For theseconsiderations and others designers tend to avoid these circuits. Hybrid and modularlog

This application report illustrates how to manage the code/data in a system that performs dynamic swapping of routines on demand. This is process is achieved by following a simple setup procedure. This method is one of many ways to implement a dynamic swapping of applications.

The examples given in this report are simplified versions of a working code and are specific to C55x? family of DSPs.

ADC16DX370 Equalization Optimization of the ADC16DX370 JESD204B Serial Link

This revision of the Fast GTL Backplanes With the GTL1655 application report addresses improvements such as the improved OECE circuitry and implementation of theTexas Instruments TI-OPCE circuitry that have been incorporated in the GTLPH1655 device. These improvements significantly improve signal integrity in distributed loads.This application report describes the physical principles of fast

This application report presents the steps necessary to update the bq20z80 firmware and the EVM.

This application report shows how easy it is to interface the DAC7654 digital-to-analog converter to the MSP430F449 mixed signal microcontroller using the SPI mode of serial communication. By using th

TMS320C6713 to TMS320C672x Migration Guide Application Report

This report describes various methods for connecting the ADS7842 to Texas Instruments TMS320C5400 DSP and TMS320C6000 DSP platforms. The ADS7842 is a 4-channel 12-bit analog-to-digital converter (ADC) with a maximum sampling rate of 200 kHz.

Receipt of data from a TIA/EIA-422 line driver can be accomplished by using a TIA/EIA-644 line receiver with the addition of an attenuator circuit. This technique gives the user a very high-speed low-power 422 receiver.If ground noise between the transmitter and receiver is not a concern (less than +/-1 V) a resistor divider circuit can be placed in front of the LVDS receiver to attenuate th

Removal of lead (Pb) from finished integrated-circuit(IC) packages as well as IC package assembly and printed circuit board(PCB) assembly operations is an ongoing effort by many electronics manufacturers.Toward this end the semiconductor industry is converting to nickel/palladium (Ni/Pd)-finished leadframes in the assembly of integrated circuits. This technology eliminates Pb from the IC pa