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Application Notes from Texas Instruments

AN-643 EMI/RFI Board Design (Rev. B)

Texas Instruments
Application Note 643 EMI/RFI Board Design

Selection and Specification of Crystals for TI's IEEE 1394 Physical Layers

Texas Instruments
To comply with the IEEE 1394 standard, each node in a 1394 bus must have a system clock of 49.152 MHz +/- 100 parts per million (ppm) (approximately 49.1471 MHz to 49.1569 MHz). For Texas Instruments

AN-71 Micropower Circuits Using the LM4250 Programmable Op Amp (Rev. B)

Texas Instruments
This application report describes the circuit operation of the Texas Instruments LM4250 various methodsof biasing the device frequency response considerations and some circuit applications exercising theunique characteristics of the LM4250.

Using the PT6100/6210/6300 as a Constant Current Source (Rev. A)

Texas Instruments
Using the PT6100/6210/6300 as a Constant Current Source

TMS320TCI6482 Power Consumption Summary (Rev. A)

Texas Instruments
This application report discusses the power consumption of the Texas Instruments TMS320TCI6482 digital signal processor (DSP). The power consumption on the TCI6482 device is highly application-dependent; therefore a power spreadsheet that predicts power consumption is provided along with this document. The power spreadsheet can be used for the purpose of modeling power consumption for user applic

AN-386 A Non-Complementary Audio Noise Reduction System (Rev. C)

Texas Instruments
The popularity of companding or complementary noise reduction systems is self-evident. Nearly allmedium to high quality cassette tape decks include either Dolby®B or Dolby C type noise reduction. Ascant few have different systems such as dbx or Hi-Com. The universal appeal of compandors to n.r.system designers is the amount of noise reduction they can offer yet one of the major reasons t

Digitally Programmable, Time-Continuous Active Filter

Texas Instruments
Programmable active filters have increased in popularity over the past decade. With the advent of switched capacitor topologies, filter parameters such as the natural frequency and filter Q can be cha

Understanding the Pwr Sup Require of PCI Bus Stnd-How to Protect the Dig Compnts (Rev. B)

Texas Instruments
This application report provides an analog design guide to the PCI system designers.

Multi-DC/DC Conversion & Color LED Control Integrated on a C2000 Microcontroller

Texas Instruments
Multi-DC/DC Conversion & Color LED Control Integrated on a C2000 Microcontroller LED_SPRABR7_ZHCA515

TNETE2201 EVM Kit Setup and Usage

Texas Instruments
The Texas Instruments (TI)(tm) TNETE2201 EVM (evaluation module) kit is a tool used to evaluate and design high-speed prototypes using the TNETE2201 Ethernet Transceiver IC (10 mm x 10 mm TQFP plastic package). The EVM kit is used to evaluate device parameters while acting as a guide for high-speed board layout.The high-speed interface is selectable between a 50-ohm SMA connector and a GBIC s

Capacitive Touch Sensing, MSP430 Slider and Wheel Tuning Guide

Texas Instruments
This application report provides guidelines on how to tune capacitive touch sliders and wheels running on the MSP430? microcontrollers. It identifies the hardware and software parameters as well as ex

Mini-LVDS Interface Specification (Rev. A)

Texas Instruments
The mini-LVDS Interface Specification

JEDEC Publication 95

Texas Instruments
Many electronics companies have joined the Joint Electron Device Engineering Council (JEDEC) and the JC-11 Mechanical (Package Outline) Standardization committee to gain further understanding of industry package standards and to register their product lines. As a member of JC-11 the company receives a hardcopy of Publication 95 that generally is in the custody of the committee member. The publica

OMAP3530 Easy CUS Package PCB Escape Routing (Rev. A)

Texas Instruments
The OMAP3530 CUS package is designed with a new technology called Via Channel™ array. This technology allows for easy routing of the device in two signal and two power layers using standard 20 mil diameter and 10 mil finished hole size via; it is cost and time effective. This application report shows how to easily route the entire package by first routing one quadrant only and then copying i

TAS5110D6REF Data Report

Texas Instruments
TAS5110D6REF Data Report

Comparison of TI Voiceband Codecs for Telephony Applications

Texas Instruments
This application report describes the different types of voice-band CODECs for telephony applications such as client modem analog interface circuits central office line card CODEC/filter combos and voice-band audio processors. A summary of the characteristics of each is included.This report focuses on the recommended client modem analog interface circuits (AICs) fabricated by Texas Instrumen

Multicell Li-Ion and Li-Pol Battery Gas-Gauge Application Using the bqJunior

Texas Instruments
The bqJunior™ series of gas gauges are designed to operate from a single-cell lithium-ion or lithium-polymer battery. Many applications that could benefit from using these gas gauges use two or more lithium cells in series where the battery voltage exceeds the operating voltage for the bqJunior™ gas gauges. This application report describes a low-component count solution for using th

How to Optimize Your Target Application for RTDX Throughput (Rev. A)

Texas Instruments
Real-Time Data Exchange (RTDX?) is a technology developed by Texas Instruments that enables real-time bi-directional communication between a digital signal processor (DSP) or microcontroller and a host application.

This document describes how to increase the target-to-host throughput of an RTDX target application. This document does not describe how to increase the host-to-target throughput alt

Flatlink Data Transmission System Design Overview (Rev. A)

Texas Instruments
FlatLink is a data transmission system that can provide better than a 2:1 reduction in the number of signal lines used for synchronous parallel data bus structures with no loss in data throughput. To do this FlatLink takes single-ended data at clock rates of up to 68 MHz and increases the data signaling rate seven times up to 476 Mbps. The following report provides some design guidelinesfo

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