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Application Notes from Texas Instruments

LXT971/972A to DP83848C/I/YB PHYTER System Rollover Document (Rev. B)

Texas Instruments
This application report provides points to be considered when upgrading an existing 10/100 Mb/s Ethernetdesign using Intel’s LXT971 or LXT972A Ethernet Physical Layer (PHY) product to the new TexasInstruments DP83848C/I/YB PHYTER™ product.

Programming the UCC3809 for 90% Maximum Duty Cycle Clamp

Texas Instruments
Normally the UCC3809 programmable duty cycle clamp feature is limited to 70% maximum duty cycle. The described technique shows how the maximum duty cycle clamp can be programmed to achieve a 90% on-time of the switching period.

Using the TMS320DM646x DMSoC Bootloader (Rev. D)

Texas Instruments
This document describes the functionality of the TMS320DM6467 Digital Media System-on-Chip (DMSoC) ARM ROM bootloader (RBL) software. The ARM ROM bootloader resides in the ROM of the device beginning at address 0x00008000. The RBL implements methods for booting in the listed modes and uses boot configuration pins to determine boot mode. If an improper boot mode is chosen or an error is detected d

Initializing the Fixed-Point EVM's AIC

Texas Instruments
There are two pairs of AIC registers, TA, TB and RA, RB, which control the sampling rate, fs, and low-pass filter cutoff frequency, fc. (The T and R mean transmit and receive.) This document discusses

TSW3725: Modifying to use the TRF3705 for Performance and BOM Improvements

Texas Instruments
TRF3705, TSW3725EVM TSW3725 Performance and Required Modifications Using the TRF3705 LEAVE IN MS WORD

What's New in Code Composer Studio Development Tools v2.2 (Rev. A)

Texas Instruments
This application report highlights new features and functionality in Code Composer Studio? v2.2. In addition to providing enhancements and bug fixes from Code Composer Studio v2.1, the latest version

Pressure Transducer to ADC Application

Texas Instruments
A range of bridge-type transducers can measure numerous process variables. This report describes a pressure transducer and a bridge transducer to measure strain in mechanical elements. It gives an example circuit from which to implement other applications.

Interfacing an EEPROM via I2C Using the MSP430 (Rev. A)

Texas Instruments
This report describes the implementation of I2C communication between the MSP430F16x USART or the MSP430F2xx USCI I2C hardware module and an external EEPROM (24xx128). The application report implements various EEPROM protocols such as Byte Write Page Write Current Address Read RandomAddress Read Sequential Read and Acknowledge Polling.

TVP5147M1 Patch Code Download Guidelines (Rev. A)

Texas Instruments
TVP5147M1 Patch Code Download Guidelines

Asynchronous Channel Hopping System for FCC 15.247 Compliance

Texas Instruments
This application report shows how to use the CC112x and CC12xx series of transceivers in a Frequency Hopping Spread Spectrum system. This allows for transmit powers up to 1 W and utilization of narrow

Application of the Texas Instruments AUC Sub-1-V Little Logic Devices (Rev. A)

Texas Instruments
Power consumption and speed are always concerns in electronic system logic design. Texas Instruments (TI) announces the industry?s first sub-1-V logic family that provides significant benefits to portable consumer electronics by operating at low power and high speed while maintaining overall system signal integrity. TI?s next-generation logic family is the advanced ultra-low-voltage CMOS (AUC) fa

A DSP/BIOS Generic DMA McBSP Device Driver for TMS320C5000 DSPs (Rev. A)

Texas Instruments
A DSP/BIOS Generic DMA McBSP Device Driver for TMS320C5000 DSPs Application Report

TMS320C642x Power Consumption Summary (Rev. D)

Texas Instruments

This application report discusses power consumption of the Texas Instruments TMS320C642x Digital Signal Processor (DSP). Power consumption is highly application-dependent, so a spreadsheet is provided to model power consumption for your applications.

The Key to Understanding Sources Of Error in the ISO100 Isolation Amplifier

Texas Instruments
This application bulletin describes how to quantify the effects of these potential errors and to help identify the most appropriate means of correction.

Hot Swap Performance Comparison

Texas Instruments
Various integrated circuit controllers are currently available for implementing hot swap in telecommunication (nominal ?48-V supply) systems. Two such device types are the TPS239x series and the LT164

TMS320DM816x/C6A816x/AM389x DDR3 Initialization With Software Leveling

Texas Instruments
This article has been contributed to the TI Embedded Processors Wiki. The article describes how to initialize the DDR3 on the TMS320DM816x DaVinci™ digital media processors TMS320C6A816x Integra™ DSP+ ARM® processors and AM389x Sitara™ ARM® microprocessors (MPUs) PG1.1 samples using the software leveling process.

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