Correcting the Low-Frequency Response of the ADS42LBxx, ADS42JBxx for Time-Domai
Texas InstrumentsIn this application report, simple schemes are described to correct the low-frequency response of ADS42LBxx, ADS42JBxx family of analog-to-digital converters (ADCs). The described schemes are…
Method of Graphing Safe Operating Area (SOA) Curves in DC-DC Converter
Texas InstrumentsMethod of Graphing Safe Operating Area (SOA) Curves in DC-DC Converter TPS546C23
Reduce Electrical Stresses in a PFC stage during an AC drop test with UCD3138
Texas InstrumentsReduce Electrical Stresses in a PFC stage during an AC drop test with UCD3138
Support Selfie Sticks Using a TS3A227E Audio Jack Switch
Texas InstrumentsSupport Selfie Sticks Using a TS3A227E Audio Jack Switch TS3A227E
Generic Wrist Watch Programmer's Guide (Rev. A)
Texas InstrumentsGeneric Wrist Watch Programmer's Guide /Microcontrollers/MSP/App_Reports/SLAA671
Generation of a VCOM buffer input using PWM signal
Texas InstrumentsIn an LCD the backlight shines through the liquid crystal material and the voltage across the liquid crystal controls how much light shines through it. An active matrix LCD (AMLCD) contains many…
Power Consumption Analysis for Low Power Capacitive Sensing Applications
Texas InstrumentsPower Consumption Analysis for Low Power Capacitive Sensing Applications
Five Steps to a Good PCB Layout of the Boost Converter
Texas InstrumentsA good PCB layout is critical for the boost converter. The reason is that the boost converter is sensitive to parasitic capacitance and inductance because of the switch-mode operation. The bad…
TI DLP® Pico™ System Design: Brightness Requirements and Tradeoffs
Texas InstrumentsThe objective of this application note is to help product developers who are new to DLP Pico technology understand brightness and the related system tradeoffs.
HiRel Hermetic Product Package Material Content (Rev. A)
Texas InstrumentsHiRel Hermetic Product Package Material Content
Routing the Middle Pins of the LP5562
Texas InstrumentsThe LP5562 is available in 12-bump DSBGA package with 0.4-mm pitch. This can be a limitation in costsensitive applications as routing out the middle bumps separately requires HDI PCB technology…
TDA3x Error Signaling Module (ESM)
Texas InstrumentsThe Error Signaling Module (ESM) in TDA3x is used to report certain activity on the monitored signals at an external error pin or to the device CPUs through interrupt. The external error pin is…
CC13xx Combined WMBUS C- and T-Mode Application Note
Texas InstrumentsCC13xx Combined WMBUS C- and T-Mode Application Note CC1310, CC1350 Connectivity/App_Reports/2-CCxxxx_AppReports/CC13xx_SWRA522
Implementing OPUS Voice Code for TM4C129x Device
Texas InstrumentsOpus is an open source royalty-free audio compression format developed by Xiph and standardized by the IETF. It utilizes lossy compression which is designed to efficiently code audio with a low…
UCC21520, a Universal Isolated Gate Driver with the Fastest Dynamic Response
Texas InstrumentsDeveloped for high-voltage applications where isolation and reliability is required, the UCC21520 delivers reinforced isolation of 5.7 kVRMS along with a common mode transient immunity (CMTI)…
Multi-Frequency Range and Tunable DCO on MSP432P4xx Microcontrollers (Rev. A)
Texas InstrumentsMulti-Frequency Range and Tunable DCO on MSP432P4xx Microcontrollers /Microcontrollers/MSP/App_Reports/SLAA658/
Designed to Go: Single- and Double-Cell Low-Dropout Li-Ion Charger Using bq2056
Texas InstrumentsSingle- and Double-Cell Low-Dropout Lithium-Ion Charger Using the bq2056
