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Application Notes from Texas Instruments

OA-11 A Tutorial on Applying Op Amps to RF Applications (Rev. B)

Texas Instruments
With operating frequencies exceeding 300MHz Texas Instruments line of monolithic and hybrid currentfeedback operational amplifiers have become an attractive option for the RF (and IF) design engineer.Typical operational amplifier specifications do not however include many of the common specificationsfamiliar to RF engineers. To help the designer exploit the many advantages these amplifier

DLP LightCommander API Application Report (Rev. C)

Texas Instruments
DLP LightCommander API Application Report DLPA014C DLP/Application_Reports

DVS For OMAP1510 Using TPS62200

Texas Instruments
Portable electronics with long battery lives are unquestionably more marketable. Power consumption of the microprocessor can be reduced by lowering the internal clock frequency and/or even more by lowering the core supply voltage. Dynamic voltage scaling (DVS) is used to reduce core supply voltage to minimize power consumption. This application note explains how to implement DVS using a TPS6220

Design 4: Support of Multiple Li-Ion Chemistries w/Impedance Track(TM) Gas Gauge (Rev. R)

Texas Instruments
Support of Multiple Li-Ion Chemistries With Impedance Track(TM) Gas Gauges

Optical Implementation Using IEEE-1394.b (Rev. A)

Texas Instruments
IEEE Std 1394b-2002 specification allows the use of optical media for longer distances at higher speeds. The use of optical media provides galvanic isolation lower electromagnetic interference (EMI) and lower interference from the environment.Interfacing 1394.b physical-layer devices (PHYs) may require additional components depending on the type of fiber-optic transceiver (FOT) selected. Th

Bq2000 in Constant Voltage Phase for Li-ion Battery

Texas Instruments
The bq2000 charger can be used to charge Li-Ion, NiCd, or NiMH batteries. It uses three charging modes, the pre-charge, fast charge, and termination mode. It detects the battery chemistry type during

C Routines for Setting Up the AIC on the TMS320C5x EVM

Texas Instruments
This document discusses how to use the C programming language to control the AIC on the TMS320C5x EVM. Different ways of doing this are shown with code listings and examples for each.

DSP/BIOS Real-Time Analysis (RTA) and Debugging Applied to a Video Application

Texas Instruments
DSP/BIOS and the Reference Frameworks allow developers to non-intrusively instrument real-time applications. The software provided with this application note applies real-time analysis (RTA) services to a working application--?a H.263 encode/decode loopback example for the TMS320DM642 evaluation module. The software demonstrates techniques for benchmarking and controlling video software. It also i

Audio Capacitive Touch BoosterPack MSP430 Software

Texas Instruments
The LaunchPad™ ACTBP host application is the firmware running on the MSP430 LaunchPad development kit to demonstrate the Audio Player Recorder Framework for the C5000™ Audio Capacitive Touch BoosterPack.

Usage of MPU Subregions on TI Hercules ARM Safety MCUs

Texas Instruments
A Memory Protection Unit (MPU) is a module used to modify the memory types and attributes as defined in a processor?s memory ordering model. The MPU is specific to each core in the system and can only

Clock Divider Circuit for the ADS1202 in Mode 3 Operation

Texas Instruments
The ADS1202 is a precision 80dB dynamic range delta-sigma (ΔΣ) modulator operating from a single +5V supply. The differential inputs are ideal for direct connections to transducers or low-level signals. With the appropriate digital filter and modulator rate the device can be used to achieve 15-bit analog-to-digital conversion with no missing codes. This application note describes ho

Wall Adapter Powers IEEE 802.3af Powered Device

Texas Instruments
Power-on-Ethernet is an emerging technology that allows an existing Ethernet connection to carry both data and power. However today's powered-device (PD) designers face a dilemma - not all Ethernet connections are wired for power. To operate with these legacy connections a PD can use a wall adapter but this capability must be designed into the PD.

Using the AM17xx Bootloader (Rev. C)

Texas Instruments
This application report describes various boot mechanisms supported by the AM17xx bootloader read-only memory (ROM) image. Topics covered include the Application Image Script (AIS) boot process an AISgen tool used to generate boot scripts protocol for booting the device from an external master device a UART Boot Host GUI for booting the device from a host PC and any limitations default settin

3D Analog Front End: Migrating From TMS37122 and TMS37127 to TMS37126D3

Texas Instruments
The TMS37122, TMS37127 and TMS37126 devices belong to the Passive Entry and Passive Start (PEPS) product family used mainly for automotive applications. These devices are also usable in industrial app

Evaluation 2: Exploring the bq20z80 Impedance Track Evaluation Kit

Texas Instruments
The bq20z80 evaluation module (EVM) and its corresponding evaluation software provides a rich and effective environment for examining the bq20z80 - a new advanced battery gas gauge. This application report covers this EVM and software with an emphasis on how to use it and what to expect. EVM board connections are discussed in detail and helpful hints are offered. For the evaluation software com

Quick Start Guide for a 0.5 Amp Buck Regulator Using The LM5574 and LM25574 (Rev. B)

Texas Instruments
The LM5574 and LM25574 switching regulators feature all of the functions necessary to implement an efficient high voltage buck regulator using a minimum of external components. These easy to use reg

3 V Accelerometer Featuring TLV2772 Application Brief

Texas Instruments
This application brief describes a 3-axis acceleration data collection system that uses a TLV2772 operational amplifier to amplify and filter sensor electrical signals. Use of the available evaluation

Thermal Performance of SWIFT(TM) DC/DC Converters in the 28-Pin HTSSOP Package

Texas Instruments
The thermal management of printed-circuit boards is complex but must be well understood to achieve optimum performance and reliability. SWIFT(TM) dc/dc converters in the 28-pin HTSSOP package rely on an exposed lead frame die pad [PowerPAD(TM)] on the bottom of the package to provide an extremely low thermal resistance from junction to case. The thermal performance of the 6- 9- and 14-A SWIFT d

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