Interfacing the DAC8554EVM to TMS320C6x Processors

This application report describes the implementation of the radix-4 decimation in frequency (DIF) fast Fourier transform (FFT) algorithm using the Texas Instruments (TI(TM)) TMS320C80 digital signal processor (DSP). The radix-4 DIF algorithm increases the execution speed of the FFT.Each TMS320C80 DSP parallel processor (PP) contains four major units operating in parallel. This parallel operati

Ceramic Flatpack

TLV320AIC3254, TLV320AIC3204 TLV320AIC32x4 Sleep and Standby Modes /HPA/AIP/Audio_Converters/2-App_Reports/SLAA473/TLV320AIC32x4_Sleep_Standby_Mode

The IEEE 1149.1 standard developed by the Joint Test Action Group (JTAG) provides a framework for a structured test approach to improve IC and board level testing while eliminating after-the-fact test approaches. This document previews three integrated circuits (ICs) a test bus controller (TBC) a SCOPE scan path selector (SPS) and a SCOPE digital bus monitor (DBM) that support the standard for

This application report outlines the SPICE model of the THS3001 high-speed monolithic operational amplifier. General information about the model file structure performance comparison model listing and a brief comment about symbols are included. The listing can be copied and pasted into an ASCII editor or it can be down loaded by visiting the THS3001 product folder at http://www.ti.com/sc/docs/

AN073 -- RemoTI Power Consumption Application Note PDF Source with associated excel file

AN060 - Security on TI IEEE 802.15.4 Compliant RF Devices This application note introduces IEEE 802.15.4 security and gives practical examples using Texas Instruments? family of IEEE 802.15.4 complia

Improving the performance of semiconductor devices has increased per-device power consumption but not allowable junction temperatures. Historically thermal-resistance measurements have been made in a variety of ways that have not been explained thoroughly. The advantages of the JEDEC 51 method (JESD 51) are explained and compared with other methods used to determine thermal resistance of semicon

Texas Instruments Quad Flatpack No-lead (QFN) power modules allow for board miniaturization, and hold several advantages over other power module packages. The QFN packages have higher power density,

An Acoustic Transformer Powered Super-High Isolation Amplifier

Latency is a critical parameter in Ethernet networks developed for Factory Automation applications. Latency is not a defined value for Ethernet as specified by the IEEE 802.3 standard. Nor i

bq78350 Using the bq78350

TRF6903 Transceiver for KONNEX - RF System

This application note describes the design and performance characteristics of the UCC3912 Electronic Circuit Breaker. The practical aspects of applying the circuit breaker are discussed as well as its performance compared to that of other technologies. The UCC3912 integrates a power MOSFET with all of the necessary control and housekeeping functions including current limiting short-circuit prote

The automatic loudspeaker equalization (ALE) program supports the following TI digital audio processors: TAS3001 TAS3002 TAS3004 and TAS3103. This application report addresses the use of ALE in developing application-specific coefficients for the TAS3103 digital audio processor.The TAS3103 digital audio processor is a 3-channel audio processor. Many audio processing features are provided in

This application report describes the expected performance of the CC2530 and the SE2431L module. The combined CC2530 and SE2431L solution is suitable for systems targeting compliance with FCC CFR47 Pa

An Improved Line Regulation Solution Used in LM3444/5 Non-Isolated LED Lighting Word to PDF - written by a Chinese Engineer