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Application Notes from Texas Instruments

DP83867 Troubleshooting Guide (Rev. A)

Texas Instruments

A 10/100/1000 Ethernet Physical Layer device has multiple connections and many possible configuration options. While the DP83867 is designed with a priority on ease of use, there are many factors to consider during initial board bring up. This application note provides guidance on the key criteria to verify in order to expedite initial validation of DP83867 applications.

The goal of this application note is to describe a flow to identify the most likely source of problems during board bring up. For a quick start guide, please see the Troubleshooting Checklist in Section 3 at the end of this application note.

Tricolor control of TPS92314 based LED driver with toggling of main light switch

Texas Instruments
Tricolor control of TPS92314 based LED driver with toggling of main light switch

Using the TMS320C5545/35/34/33/32 Bootloader (Rev. C)

Texas Instruments
Using the TMS320C5545/35/34/33/32 Bootloader ASPH/Corazon/Application_Reports/SPRABL7/SPRABL7_Using_Bootloader

Build High-Density, High Refresh Rate, Multiplexing Panel with the TLC59581

Texas Instruments
Build High-Density, High Refresh Rate, Multiplexing Panel with the TLC59581 TLC59581

Troubleshooting Guide for PGA411-Q1

Texas Instruments
Use this guide as the first step in troubleshooting any issues while using the PGA411-Q1 device. This guide includes example waveforms and information on faults that assist in the process to troublesh

Effective System ESD Protection for TPS254x USB Charging Port Controllers

Texas Instruments
Effective System ESD Protection for TPS254x USB Charging Port Controllers PMP/Linear_Power/Power_Interface/2-App_Reports

Designing with the TRS3122E

Texas Instruments
Designing with the TRS3122E TRS3122E Application Note

Efficient Super-Capacitor Charging with TPS62740

Texas Instruments
TPS62740 Efficient Super-Capacitor Charging with TPS62740

Implementation of Programmer for Serial Bootloaders on TM4C12x Microcontroller (Rev. A)

Texas Instruments
TM4C12x microcontrollers from Texas Instruments feature ROM and Flash-based bootloaders. The bootloaders are used to download an application image to the microcontroller over universal asynchronous receiver/transmitter (UART) inter-integrated circuit (I2C) synchronous serial interface (SSI) universal serial bus (USB) or Ethernet (TM4C129x device family only) without the need to connect a JTAG o

Understanding EEPROM Programming for 25G and 28G Repeaters and Retimers

Texas Instruments
Understanding EEPROM Programming for 25G and 28G Repeaters and Retimers

Designing With the MSP430FR58xx, FR59xx, FR68xx, and FR69xx ADC (Rev. A)

Texas Instruments
Designing an application with the analog-to-digital converter (ADC) requires several considerations to optimize for power and performance. This application report discusses the basics of how you would

Moving From Evaluation to Production With MSP432P401x MCUs

Texas Instruments
This application report is intended for MSP432? microcontroller (MCU) developers currently evaluating the prerelease XMS432P401x Revision B device sampled from www.ti.com/product/msp432p401r. With the

Interfacing DRA75x and DRA74x Audio to Analog Codecs

Texas Instruments
DRA7xx Infotainment Application Processor offers an audio solution based on the multichannel audio serial port (McASP). McASP is a very flexible interface capable of interfacing with audio devices usi

66AK2L06 JESD Attachment to ADC14X250/DAC38J84 (Rev. A)

Texas Instruments
66AK2L06 JESD Attachment to ADC14X250/DAC38J84 TIDUB94 /ASPH/EP_Designs/TIDUB94

Capacitance Requirements for High Speed Signals

Texas Instruments
Capacitance Requirements for High Speed Signals Automotive ESD Protection, ESD Protection Diodes, High Performance TVS Diode

TRF7970A Firmware Design Hints (Rev. A)

Texas Instruments
This application report is a reference for the firmware developer using TRF7970A in conjunction with a microcontroller (for example, an MSP430? MCU or ARM?-based MCU).

Picking ESD Diodes for Ultra High-Speed Data Lines

Texas Instruments

This application report addresses three key criteria for selecting an ESD device for protecting high-speed signals. As the industry continues to trend towards smaller chipset features sizes to address higher speed data rates, tolerance of transient voltages has continued to shrink as well. Picking the right ESD device the first time is critical to preventing costly board re-spins during EMC testing. By using the three techniques discussed in this paper, device selection can be greatly simplified and streamlined.

Sensor Optics Selection Guide for 3D ToF Camera Systems

Texas Instruments

In a camera, the lens ensures that light coming from a given point in a scene reaches a given pixel. When an ideal lens is in perfect focus, light coming from a given point in the image will reach a given pixel only. This is an important optical component which enables cameras, including 3D time-of-flight (ToF) cameras, to work. 3D ToF cameras have certain distinct characteristics which have special requirements to be met with while selecting or designing the lenses. This document explains how to decide the specifications for 3D ToF cameras. It also describes how to choose or design lens holders.

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