Manufacturers > Texas Instruments > Application Notes > AN-1281 Bumped Die (Flip Chip) Packages (Rev. A)

AN-1281 Bumped Die (Flip Chip) Packages (Rev. A)

Texas Instruments

Published Date: 05/01/2004

Description

Application Note 1281 Bumped Die (Flip Chip) Packages

Application Note

Download application note for AN-1281 Bumped Die (Flip Chip) Packages (Rev. A) by Texas Instruments