FIFO Memories: Surface-Mount Packages For PCMCIA Applications (Rev. A)

Texas Instruments

Published Date: 03/01/1996

Description

The continuing need to reduce board space without reducing functionality has carried over to PCMCIA cards. PCMCIA card designers are challenged to reduce the size of their boards to the size of a credit card. TI meets this demand with the TQFP packaging of their advanced CMOS and BiCMOS FIFOs. This document briefly describes the three types of PCMCIA cards the TQFP packaging of the 9- 18- and 3