Heat Sinking- TO-3 Thermal Model

Texas Instruments

Published Date: 09/27/2000

Description

A critical issue with all semiconductor devices is junction temperature (TJ). TJ must be kept below its maximum rated value typically 150°C. The lower the junction temperature the better. The thermal circuit shown allows temperature to be estimated with simple calculations. The temperature rise across each interface is equal to the total power dissipated in the device ti

Parts

Part Number Name Companion Part
OPA512BM OPA512BM Buy Datasheet
OPA512SM OPA512SM Buy Datasheet