The following land pattern recommendations are provided as guidelines for board layout and assembly purposes.
These recommendations cover the following National Semiconductor packages: PLCC, PQFP, SOP, SSOP and TSOP.
For SOT-23 (5-Lead) and TO-263 (3- or 5-Lead) packages, refer to land patterns shown in the Physical Dimensions for MA05A and TS3B or TS5B packages, respectively.