Description

This gold(Au) embrittlement study evaluates TI?s original four-layer nickel-palladium(NiPd) lead finish that was introduced in 1989 and TI?s nickel-palladium-gold(NiPdAu) lead finish that replaced four-layer NiPd in 2001. Samples were prepared with three different Au thicknesses for the NiPdAu components. The printed wiring board(PWB) finishes used were organic solderability preservative(OSP) and