Package Thermal Characterization Methodologies

Texas Instruments

Published Date: 08/26/1998

Description

Improving the performance of semiconductor devices has increased per-device power consumption but not allowable junction temperatures. Historically thermal-resistance measurements have been made in a variety of ways that have not been explained thoroughly. The advantages of the JEDEC 51 method (JESD 51) are explained and compared with other methods used to determine thermal resistance of semicon