Manufacturers > Texas Instruments > Application Notes > PCB Assembly Guidelines for 0.4mm Package-On-Package(PoP) Packages, Part II

PCB Assembly Guidelines for 0.4mm Package-On-Package(PoP) Packages, Part II

Texas Instruments

Published Date: 09/12/2008

Description

Part ? II Assembly Guidelines 0.4mm Package-On-Package ?PoP? Application Note OMAP3

Application Note

Download application note for PCB Assembly Guidelines for 0.4mm Package-On-Package(PoP) Packages, Part II by Texas Instruments