Manufacturers > Texas Instruments > Application Notes > PCB Design Guidelines for 0.4mm Package-On-Package (PoP) Packages, Part I (Rev. B)

PCB Design Guidelines for 0.4mm Package-On-Package (PoP) Packages, Part I (Rev. B)

Texas Instruments

Published Date: 06/13/2009

Description

Ball grid array (BGA) packages having 0.4mm ball pitch require careful attention to printed circuit board (PCB) design parameters to successfully yield reliable and robust assemblies; the standard rul

Parts

Part Number Name Companion Part
AM3703CBC AM3703CBC Buy Datasheet
AM3703CBP AM3703CBP Buy Datasheet
AM3703CBP100 AM3703CBP100 Buy Datasheet
AM3703CBPA AM3703CBPA Buy Datasheet
AM3703CBPD100 AM3703CBPD100 Buy Datasheet
AM3703CUS AM3703CUS Buy Datasheet
AM3703CUSA AM3703CUSA Buy Datasheet
AM3715CBC100 AM3715CBC100 Buy Datasheet
AM3715CBCD100 AM3715CBCD100 Buy Datasheet
AM3715CBP AM3715CBP Buy Datasheet
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Application Note

Download application note for PCB Design Guidelines for 0.4mm Package-On-Package (PoP) Packages, Part I (Rev. B) by Texas Instruments