Description

This application report addresses three key criteria for selecting an ESD device for protecting high-speed signals. As the industry continues to trend towards smaller chipset features sizes to address higher speed data rates, tolerance of transient voltages has continued to shrink as well. Picking the right ESD device the first time is critical to preventing costly board re-spins during EMC testing. By using the three techniques discussed in this paper, device selection can be greatly simplified and streamlined.