Thermal Considerations for RF Power Amplifier Devices Application Report

Texas Instruments

Published Date: 02/25/1998

Description

The fundamentals of printed circuit board (PCB) layout, thermal heatsink definition, and die temperature calculations are examined. PCB layout approaches that enhance heat transfer are also discussed,

Parts

Part Number Name Companion Part
TRF7003PK TRF7003PK Buy Datasheet
TRF7003PKR TRF7003PKR Buy Datasheet
TRF7610PWP TRF7610PWP Buy Datasheet
TRF8010PWP TRF8010PWP Buy Datasheet
TRF8010PWPR TRF8010PWPR Buy Datasheet