Thermal Derating Curves For Logic-Products Packages (Rev. B)

Texas Instruments

Published Date: 05/07/2009

Description

Thermal metrics such as qJA and qJC are used to compare thermal performance of plastic integrated circuit (IC) packages. The thermal conductivity of all materials of the IC packaging and of the test board affect the thermal resistance values reported by semiconductor manufacturers. Recent advancements in reporting thermal data include standard test-board designs. Texas Instruments (TI) has publi