Series: OMAP3525
Part Number: OMAP3525DCBC
Description
Applications Processor 515-Pin POP-FCBGA Tray
| Title | Manufacturer | Published |
|---|---|---|
| PCB Assembly Guidelines for 0.5mm Package-on-Package Apps Processors, Part II | Texas Instruments | 06/23/2010 |
| PCB Design Guidelines for 0.4mm Package-On-Package (PoP) Packages, Part I (Rev. B) | Texas Instruments | 06/13/2009 |
| OMAP3530/25/15/03 CBB, CBC & CUS Reflow Profiles | Texas Instruments | 11/13/2009 |
| OMAP35x to AM35x Hardware Migration Guide | Texas Instruments | 05/24/2010 |
| PCB Assembly Guidelines for 0.4mm Package-On-Package (PoP) Packages, Part II (Rev. A) | Texas Instruments | 11/01/2013 |
| OMAP35x 0.65mm Pitch Layout Methods (Rev. B) | Texas Instruments | 06/26/2008 |
| Introduction to TMS320C6000 DSP Optimization | Texas Instruments | 10/06/2011 |
| OMAP35x Linux PSP Data Sheet | Texas Instruments | 10/16/2009 |
| OMAP35x to AM37x Hardware Migration Guide | Texas Instruments | 06/03/2010 |
| Powering OMAP?3 With TPS65023: Design-In Guide (Rev. B) | Texas Instruments | 03/02/2009 |
| PCB Design Guidelines for 0.5mm Package-On-Package Apps Processors, Part I | Texas Instruments | 06/23/2010 |
| Title | Type | Part number |
|---|---|---|
| XDS560™ software v2 system trace USB debug probe | Debug probe | TMDSEMU560V2STM-U |
| XDS200 USB Debug Probe | Debug probe | TMDSEMU200-U |
| XDS560v2 System Trace USB & Ethernet Debug Probe | Debug probe | TMDSEMU560V2STM-UE |
| TMDSEVM3530 | Evaluation Modules & Boards | TMDSEVM3530 |