Intel IMVP7 3rd Generation Core Mobile (Core i7) Power Management Reference Design
Description
The Intel® Core i7 power management design is a reference design for Intel IMVP-7 SVID. A GUI communication program is available along with several test points on the board to evaluate the static and dynamic performance of the CPU's DC/DC controller. The design features an IMVP-7 3-phase CPU supply: a 2-phase GPU Vcore supply: a 1.05-VCC IO supply: and a DDR3L/DDR4 memory rail. To greatly improve power density and thermal performance: 5-mm x 6-mm NEXFET power block MOSFETs are used.
Features
- • Design supports a 9 to 20-V input from Vbatt• Small high-density power solution for ivy bridge• 3-phase CPU supply supports up to 94 A• 90% peak (80% full-load) efficiency from 12 Vin to 1.05V out - CPU supply• Low CPU supply ripple: 25 mV• Design has been built and tested: and a board is available
Applications
- CPU (PLC Controller)
- Communication module
Product Categories
- Power management
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| Download the bill of materials for TIDA-00021 | Download |
Test Data
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Download the test file for TIDA-00021| Title | Updated | Type | Size (KB) | |
|---|---|---|---|---|
| TIDA-00021 PCB | 23 Aug 2013 | 3815 | ||
| TIDA-00021 Gerber | 23 Aug 2013 | ZIP | 2074 | |
| TIDA-00021 BOM | 23 Aug 2013 | 145 | ||
| TIDA-00021 Schematic | 23 Aug 2013 | 913 |